EP 1537394 A1 20050608 - SOI COMPONENT COMPRISING MARGINS FOR SEPARATION
Title (en)
SOI COMPONENT COMPRISING MARGINS FOR SEPARATION
Title (de)
SOI BAUTEIL MIT STEGEN ZUR VEREINZELUNG
Title (fr)
COMPOSANT SOI A JONCTIONS DE SEPARATION
Publication
Application
Priority
- DE 0301438 W 20030506
- DE 10241450 A 20020906
Abstract (en)
[origin: DE10241450A1] Production of a deformation sensor comprises applying a sacrificial layer on or in a substrate, applying an activated layer (10) on the sacrificial layer and arranging sensitive regions (12) and electrical structures (13, 14) on or in the activated layer. A peripheral trench (11) is produced around the region of a sensor element (15) with the sensitive region and electrical structures. The trench is interrupted by connecting sites (25) which connect the region of the sensor element with part of the activated layer lying outside of the trench. The sacrificial layer is removed below the region of the sensor element.
IPC 1-7
IPC 8 full level
G01B 7/16 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); G01M 17/007 (2006.01); H01L 21/30 (2006.01); H01L 21/78 (2006.01); H01L 29/84 (2006.01)
CPC (source: EP US)
G01M 17/0072 (2013.01 - EP US); Y10T 29/49007 (2015.01 - EP US); Y10T 29/49117 (2015.01 - EP US); Y10T 29/49121 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49156 (2015.01 - EP US)
Citation (search report)
See references of WO 2004027367A1
Citation (examination)
- US 5882532 A 19990316 - FIELD LESLIE A [US], et al
- DE 10156406 A1 20030605 - BOSCH GMBH ROBERT [DE]
- US 6332359 B1 20011225 - UEYANAGI KATSUMICHI [JP], et al
Designated contracting state (EPC)
DE ES FR GB
DOCDB simple family (publication)
DE 10241450 A1 20040318; EP 1537394 A1 20050608; JP 2005538568 A 20051215; US 2006154448 A1 20060713; US 7398588 B2 20080715; WO 2004027367 A1 20040401
DOCDB simple family (application)
DE 10241450 A 20020906; DE 0301438 W 20030506; EP 03735275 A 20030506; JP 2004536807 A 20030506; US 52718305 A 20051114