EP 1537760 B1 20081203 - A BTE/CIC AUDITORY DEVICE AND MODULAR CONNECTOR SYSTEM THEREFOR
Title (en)
A BTE/CIC AUDITORY DEVICE AND MODULAR CONNECTOR SYSTEM THEREFOR
Title (de)
HINTER-DEM-OHR/VOLLSTÄNDIG-IN-DEM-OHR HÖRGERÄT UND MODULARES VERBINDUNGSSYSTEM H
Title (fr)
DISPOSITIF AUDITIF BTE/CIC ET SYSTEME DE CONNECTEUR MODULAIRE ASSOCIE
Publication
Application
Priority
- US 0326849 W 20030829
- US 23882902 A 20020910
Abstract (en)
[origin: WO2004025990A1] An earpiece auditory device includes a behind-the-ear (BTE) component, which includes processing circuitry. In an embodiment, the device also includes a completely-in-canal (CIC) component, shaped to fit into the ear canal of the user such that it touches the bony portion of the ear canal. In some embodiments, the CIC component includes either a universal fit or a custom fit ear mold. The custom fit ear mold can be fabricated using a rapid prototyping technology, in which the contours of the users'ear canal are scanned, and the scan data is used either directly or indirectly to replicate the ear canal contours of that user into the custom fit ear mold. In some embodiments, the ear mold is detachably interconnected with a speaker module, preferably using either an intermediate sleeve or a detachable locking pin assembly. In another embodiment, the speaker module is permanently encapsulated within the ear mold.
IPC 8 full level
H04R 25/00 (2006.01); H04R 25/02 (2006.01)
CPC (source: EP US)
H04R 25/45 (2013.01 - EP US); H04R 25/60 (2013.01 - EP US); H04R 25/604 (2013.01 - EP); H04R 25/609 (2019.04 - EP US); H04R 2225/0213 (2019.04 - EP US); H04R 2225/0216 (2019.04 - EP US); H04R 2225/57 (2019.04 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004025990 A1 20040325; AT E416592 T1 20081215; AU 2003260110 A1 20040430; DE 60325072 D1 20090115; DK 2001263 T3 20140630; EP 1537760 A1 20050608; EP 1537760 B1 20081203; EP 2001263 A2 20081210; EP 2001263 A3 20090128; EP 2001263 B1 20140326; ES 2321093 T3 20090602
DOCDB simple family (application)
US 0326849 W 20030829; AT 03795635 T 20030829; AU 2003260110 A 20030829; DE 60325072 T 20030829; DK 08075777 T 20030829; EP 03795635 A 20030829; EP 08075777 A 20030829; ES 03795635 T 20030829