EP 1543083 B1 20060809 - PROCESS AND INK FOR MAKING ELECTRONIC DEVICES
Title (en)
PROCESS AND INK FOR MAKING ELECTRONIC DEVICES
Title (de)
VERFAHREN UND TINTE ZUR HERSTELLUNG ELEKTRONISCHER BAUTEILE
Title (fr)
PROCEDE ET ENCRE POUR LA FABRICATION DE DISPOSITIFS ELECTRONIQUES
Publication
Application
Priority
- GB 0303697 W 20030822
- GB 0221892 A 20020920
Abstract (en)
[origin: US7427360B2] A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the etch-resistant ink to actinic radiation and/or particle beam radiation to effect polymerisation, removing exposed metal or alloy by a chemical etching process and then removing the polymerised etch-resistant ink by alkali wherein the etch-resistant ink is substantially solvent free and comprises the components: A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono or higher functionality wherein 5-95% by weight is one or more mono-functional monomers; B) 1 to 30 parts acrylate functional monomer containing one or more acid groups; C) 0 to 20 parts polymer or prepolymer; D) 0 to 20 parts radical initiator; E) 0 to 5 parts colorant; F) 0 to 5 parts surfactant; and wherein the ink has a viscosity of not greater than 30 cPs (mPa.s) at 40° C. and all parts are by weight.
IPC 8 full level
C09D 11/10 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
C09D 11/10 (2013.01 - KR); C09D 11/101 (2013.01 - EP US); C09D 11/36 (2013.01 - EP US); H05K 3/0076 (2013.01 - EP US); H05K 3/06 (2013.01 - KR); H05K 3/061 (2013.01 - EP US); H05K 2203/013 (2013.01 - EP US); Y10T 428/24917 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004026977 A1 20040401; AT E335796 T1 20060915; AU 2003260741 A1 20040408; CN 1694934 A 20051109; DE 60307485 D1 20060921; DE 60307485 T2 20070412; EP 1543083 A1 20050622; EP 1543083 B1 20060809; GB 0221892 D0 20021030; JP 2005539391 A 20051222; KR 100966508 B1 20100629; KR 20050057463 A 20050616; TW 200422356 A 20041101; TW I340754 B 20110421; US 2006154033 A1 20060713; US 7427360 B2 20080923
DOCDB simple family (application)
GB 0303697 W 20030822; AT 03797366 T 20030822; AU 2003260741 A 20030822; CN 03825204 A 20030822; DE 60307485 T 20030822; EP 03797366 A 20030822; GB 0221892 A 20020920; JP 2004537257 A 20030822; KR 20057004711 A 20030822; TW 92125054 A 20030910; US 52858205 A 20051018