Global Patent Index - EP 1546027 A2

EP 1546027 A2 20050629 - METHOD AND MICROMECHANICAL COMPONENT

Title (en)

METHOD AND MICROMECHANICAL COMPONENT

Title (de)

VERFAHREN UND MIKROMECHANISCHES BAUELEMENT

Title (fr)

PROCEDE ET COMPOSANT MICROMECANIQUE

Publication

EP 1546027 A2 20050629 (DE)

Application

EP 03717116 A 20030227

Priority

  • DE 0300630 W 20030227
  • DE 10244785 A 20020926

Abstract (en)

[origin: WO2004028956A2] Disclosed are a production method and a micromechanical component, in which porous silicon (106) is used as a sacrificial layer and a functional layer (130) is exposed by etching away the sacrificial layer.

IPC 1-7

B81B 3/00

IPC 8 full level

B81B 3/00 (2006.01)

CPC (source: EP US)

B81C 1/00476 (2013.01 - EP US); B81B 2201/12 (2013.01 - EP US); B81B 2203/0118 (2013.01 - EP US); B81C 2201/0109 (2013.01 - EP US); B81C 2201/0115 (2013.01 - EP US)

Citation (search report)

See references of WO 2004028956A2

Designated contracting state (EPC)

CH DE FR GB LI

DOCDB simple family (publication)

WO 2004028956 A2 20040408; WO 2004028956 A3 20041223; DE 10244785 A1 20040408; EP 1546027 A2 20050629; JP 2006500232 A 20060105; US 2006037932 A1 20060223

DOCDB simple family (application)

DE 0300630 W 20030227; DE 10244785 A 20020926; EP 03717116 A 20030227; JP 2004538667 A 20030227; US 52942505 A 20050916