Global Patent Index - EP 1546435 B1

EP 1546435 B1 20070725 - METHOD FOR PRETREATING A SURFACE OF A NON-CONDUCTING MATERIAL TO BE PLATED

Title (en)

METHOD FOR PRETREATING A SURFACE OF A NON-CONDUCTING MATERIAL TO BE PLATED

Title (de)

VERFAHREN ZUR VORBEHANDLUNG EINER OBERFLÄCHE EINES MIT METALL ZU BESCHICHTENDEN NICHTLEITENDEN MATERIALS

Title (fr)

PROCEDE POUR LE PRETRAITEMENT D'UNE SURFACE D'UN MATERIAU NON CONDUCTEUR DEVANT SUBIR UNE ELECTRODEPOSITION

Publication

EP 1546435 B1 20070725 (EN)

Application

EP 03798083 A 20030923

Priority

  • DK 0300617 W 20030923
  • DK PA200201429 A 20020926

Abstract (en)

[origin: WO2004029327A1] A method for pretreating a surface of a non-conducting material to be plated through precipitation of metal where an adsorbing metal oxide is initially deposited, such as MnO2 or Fe2O3, on the surface, whereafter said surface is treated with a solution of transition metal ions, such as Sn<++> ions, and then with a solution of metal ions of a catalytic metal catalyzing chemical plating, such as a metal of the platinum group. The transition metal ions used are selected among such ions that can reduce catalytic metal ions into catalytic metal. The method renders it possible to plate non-conducting materials, such as plastic materials, which cannot or only with great difficulty can be plated by a conventional activation by means of colloidal palladium.

IPC 8 full level

C23C 18/18 (2006.01); C23C 18/20 (2006.01); C23C 18/28 (2006.01); C25D 5/54 (2006.01); C25D 5/56 (2006.01)

CPC (source: EP US)

C23C 18/1889 (2013.01 - EP US); C23C 18/208 (2013.01 - EP US); C23C 18/285 (2013.01 - EP US); C23C 18/30 (2013.01 - EP US); C25D 5/54 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004029327 A1 20040408; AT E368136 T1 20070815; AU 2003266486 A1 20040419; DE 60315170 D1 20070906; DK 175025 B1 20040503; DK 200201429 A 20040327; EP 1546435 A1 20050629; EP 1546435 B1 20070725; US 2006000720 A1 20060105

DOCDB simple family (application)

DK 0300617 W 20030923; AT 03798083 T 20030923; AU 2003266486 A 20030923; DE 60315170 T 20030923; DK PA200201429 A 20020926; EP 03798083 A 20030923; US 52946705 A 20050328