Title (en)

POROUS METAL OXIDE SEMICONDUCTOR SPECTRALLY SENSITIZED WITH METAL OXIDE

Title (de)

SPEKTRAL MIT METALLOXID SENSIBILISIERTER POR SER METALLOXIDHALBLEITER

Title (fr)

SEMI-CONDUCTEUR D'OXYDE METALLIQUE POREUX DONT LE SPECTRE EST SENSIBILISE PAR UN OXYDE METALLIQUE

Publication

EP 1547106 A1 20050629 (EN)

Application

EP 03787808 A 20030729

Priority

• EP 03787808 A 20030729
• EP 0350345 W 20030729
• EP 02102131 A 20020813

Abstract (en)

[origin: WO2004017345A1] A porous metal oxide semiconductor with a band gap of greater than 2.9 eV spectrally sensitized on its internal and external surface with one or more metal oxides with a band-gap of less than 2.9 eV or a mixture thereof; a process for spectrally sensitizing a nanoporous metal oxide with a band-gap of greater than 2.9 eV on its internal and external surface comprising the steps of: providing a nano-porous metal oxide with a band gap of greater than 2.9 eV, applying a solution of a metal compound or salt which upon pyrolysis or upon hydrolysis and subsequent pyrolysis yields a metal oxide with a band-gap of less than 2.9 eV and heating the nano-porous metal oxide oxide with a band­gap of greater than 2.9 eV to which the metal salt had been applied to pyrolyse or hydrolyse and subsequently pyrolyse the salt to the metal oxide with a band-gap of less than 2.9 eV; and a second process for spectrally sensitizing a nano-porous metal oxide with a band-gap of greater than 2.9 eV on its internal and external surface comprising the steps of: (i) preparing a solution containing a metal compound or salt that pyrolyses or hydrolyses and subsequently pyrolyses to a metal oxide semiconductor with a band-gap of greater than 2.9 eV and a metal compound or salt that pyrolyses or hydrolyses and subsequently pyrolyses to a metal oxide with a band-gap of less than 2.9 eV, (ii) adding a water-soluble polymer to the solution prepared in step (i), (iii) coating the solution prepared in step (ii) on a support, and (iv) heating the coated support prepared in step (iii) to a temperature at which the water-soluble polymer is no longer present in the coating support.

IPC 1-7

H01G 9/20; H01L 31/0352

IPC 8 full level

H01G 9/20 (2006.01); H01L 31/0352 (2006.01)

CPC (source: EP)

H01G 9/2031 (2013.01); H01L 31/0352 (2013.01); Y02E 10/542 (2013.01)

Citation (search report)

See references of WO 2004017345A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 2004017345 A1 20040226; AU 2003262549 A1 20040303; EP 1547106 A1 20050629; JP 2006500764 A 20060105

DOCDB simple family (application)

EP 0350345 W 20030729; AU 2003262549 A 20030729; EP 03787808 A 20030729; JP 2004528513 A 20030729