EP 1547141 A4 20100224 - SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECTION BETWEEN STACKED PACKAGES
Title (en)
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECTION BETWEEN STACKED PACKAGES
Title (de)
HALBLEITER-MEHRFACHKAPSELUNGSMODUL MIT DRAHTBONDVERBINDUNG ZWISCHEN GESTAPELTEN KAPSELUNGEN
Title (fr)
MODULE MULTI-BOITIER A SEMI-CONDUCTEURS COMPORTANT UNE INTERCONNEXION DE MICROCABLAGES ENTRE DES BOITIERS
Publication
Application
Priority
- US 0328919 W 20030915
- US 41159002 P 20020917
- US 63254903 A 20030802
- US 63256803 A 20030802
- US 63255203 A 20030802
- US 63255303 A 20030802
- US 63255003 A 20030802
- US 63255103 A 20030802
Abstract (en)
[origin: WO2004027823A2] A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
IPC 8 full level
H01L 23/12 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP KR)
H01L 23/538 (2013.01 - KR); H01L 23/552 (2013.01 - EP); H01L 25/03 (2013.01 - EP); H01L 25/105 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 2224/056 (2013.01 - EP); H01L 2224/16 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/45015 (2013.01 - EP); H01L 2224/45099 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48227 (2013.01 - EP); H01L 2224/48465 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2224/854 (2013.01 - EP); H01L 2224/8592 (2013.01 - EP); H01L 2225/06568 (2013.01 - EP); H01L 2225/1023 (2013.01 - EP); H01L 2225/1052 (2013.01 - EP); H01L 2225/1058 (2013.01 - EP); H01L 2225/1094 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/12041 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H01L 2924/1532 (2013.01 - EP); H01L 2924/15321 (2013.01 - EP); H01L 2924/15331 (2013.01 - EP); H01L 2924/16152 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/19107 (2013.01 - EP); H01L 2924/3025 (2013.01 - EP)
Citation (search report)
- [XY] JP 2002217354 A 20020802 - SHINKO ELECTRIC IND CO
- [AY] US 6340846 B1 20020122 - LOBIANCO ANTHONY J [US], et al
- [AY] US 2002066952 A1 20020606 - TANIGUCHI FUMIHIKO [JP], et al
- [AY] US 5222014 A 19930622 - LIN PAUL T [US]
- [Y] US 5652185 A 19970729 - LEE SHAW WEI [US]
- [Y] JP 2000340736 A 20001208 - SONY CORP
- [X] US 5903049 A 19990511 - MORI RYUICHIRO [JP]
- [X] JP 2001223326 A 20010817 - HITACHI LTD, et al
- [X] JP 2000294723 A 20001020 - MATSUSHITA ELECTRONICS CORP
- [A] US 5247423 A 19930921 - LIN PAUL T [US], et al
- See references of WO 2004027823A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004027823 A2 20040401; WO 2004027823 A3 20040521; AU 2003272405 A1 20040408; AU 2003272405 A8 20040408; EP 1547141 A2 20050629; EP 1547141 A4 20100224; JP 2005539403 A 20051222; JP 2011181971 A 20110915; JP 2013211589 A 20131010; JP 4800625 B2 20111026; JP 5602685 B2 20141008; JP 5856103 B2 20160209; KR 101166575 B1 20120718; KR 20050044925 A 20050513; TW 200419765 A 20041001; TW 201017853 A 20100501; TW 201131731 A 20110916; TW I329918 B 20100901; TW I378548 B 20121201; TW I469301 B 20150111
DOCDB simple family (application)
US 0328919 W 20030915; AU 2003272405 A 20030915; EP 03754585 A 20030915; JP 2004568930 A 20030915; JP 2011137096 A 20110621; JP 2013123601 A 20130612; KR 20057004551 A 20030915; TW 100113640 A 20030917; TW 92125625 A 20030917; TW 98139252 A 20030917