EP 1550161 A2 20050706 - HERMETICALLY SEALED MICRODEVICES HAVING A SINGLE CRYSTALLINE SILICON GETTER FOR MAINTAINING VACUUM
Title (en)
HERMETICALLY SEALED MICRODEVICES HAVING A SINGLE CRYSTALLINE SILICON GETTER FOR MAINTAINING VACUUM
Title (de)
HERMETISCH VERSCHLOSSENE MIKROEINRICHTUNGEN MIT EINEM EINZIGEN KRISTALLISCHEN SILIZIUMGETTER ZUR AUFRECHTERHALTUNG DES VAKUUMS
Title (fr)
MICRODISPOSITIFS HERMETIQUEMENT FERMES COMPORTANT UN GETTER DE SILICIUM MONOCRISTALLIN POUR MAINTENIR LE VIDE
Publication
Application
Priority
- US 0329975 W 20030924
- US 26067502 A 20020930
Abstract (en)
[origin: US2004061207A1] A microdevice that comprises a device microstructure (22), a substrate (24), and a silicon cap (30, 130). The device microstructure (22) is attached to the substrate (24). The silicon cap (30, 130) has a base portion (32, 132) and a sidewall (34, 134) that defines a recess (36, 136) in the cap (30, 130). The silicon cap (30, 130) is attached to the substrate (24) such that the recess (36, 136) in the cap (30, 130) houses the device microstructure (22) and forms a hermetically sealed cavity (38) adjacent the device microstructure (22). The silicon cap (30, 130) further has a single crystalline silicon getter layer (40, 140) embedded along its recess (36, 136) for maintaining a vacuum within the cavity (38). There are also methods of making a microdevice containing a single crystalline silicon getter layer (40, 140).
IPC 1-7
IPC 8 full level
B81B 7/00 (2006.01)
CPC (source: EP US)
B81B 7/0038 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2004061207 A1 20040401; US 6806557 B2 20041019; AU 2003287009 A1 20040423; EP 1550161 A2 20050706; EP 1550161 A4 20101103; JP 2006501679 A 20060112; WO 2004032230 A2 20040415; WO 2004032230 A3 20040506
DOCDB simple family (application)
US 26067502 A 20020930; AU 2003287009 A 20030924; EP 03777529 A 20030924; JP 2004541623 A 20030924; US 0329975 W 20030924