EP 1551754 A2 20050713 - MICROSTRUCTURE COMPRISING A SURFACE WHICH IS FUNCTIONALISED THROUGH THE LOCALISED DEPOSIT OF A THIN LAYER AND PRODUCTION METHOD THEREOF

Title (en)

MICROSTRUCTURE COMPRISING A SURFACE WHICH IS FUNCTIONALISED THROUGH THE LOCALISED DEPOSIT OF A THIN LAYER AND PRODUCTION METHOD THEREOF

Title (de)

MIKROSTRUKTUR MIT EINER FLÄCHE, DIE DURCH DIE LOKALISIERTE ABSCHEIDUNG EINER DüNNEN SCHICHT FUNKTIONALISIERT IST, UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

MICROSTRUCTURE A SURFACE FONCTIONNALISEE PAR DEPOT LOCALISE D'UNE COUCHE MINCE ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 1551754 A2 20050713 (FR)

Application

EP 03792450 A 20030825

Priority

FR 0350036 W 20030825
FR 0210571 A 20020826

Abstract (en)

[origin: FR2843742A1] An electromechanical structure (1) incorporating a first mechanical part (102) made of a first conductive material and which includes an elastically deformable area (104) having a given thickness with an exposed surface (2) and a first organic film (4) with a given thickness, which is deposited over the entire exposed surface of the deformable area. The thickness of this first film is such that the elastic response of the deformable area including the first film does not change by more than 5% in relation to the response of the bare deformable area or the first film is ten times smaller than the thickness of the deformable area. Independent claims are also included for: (a) a pressure sensor incorporating an electromechanical microstructure; (b) a platelet incorporating an assembly of microstructures; (c) a microsystem incorporating an electromechanical microstructure.

IPC 1-7

B81B 3/00; A61B 5/00; G01L 9/00

IPC 8 full level

A61B 5/00 (2006.01); B81B 3/00 (2006.01); G01L 9/00 (2006.01)

CPC (source: EP US)

A61B 5/00 (2013.01 - EP US); B81B 3/0094 (2013.01 - EP US); G01L 9/0042 (2013.01 - EP US); B29C 2043/5825 (2013.01 - EP US); B81B 2201/0214 (2013.01 - EP US); B81B 2201/0235 (2013.01 - EP US); B81B 2201/0264 (2013.01 - EP US); B81B 2201/06 (2013.01 - EP US); B81B 2203/0127 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); Y10S 977/733 (2013.01 - EP US)

C-Set (source: EP US)

Citation (search report)

See references of WO 2004018349A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

FR 2843742 A1 20040227; FR 2843742 B1 20051014; AU 2003276377 A1 20040311; AU 2003276377 A8 20040311; CA 2496320 A1 20040304; CA 2496320 C 20121030; EP 1551754 A2 20050713; JP 2005536365 A 20051202; JP 4473123 B2 20100602; US 2005253206 A1 20051117; US 7196385 B2 20070327; WO 2004018349 A2 20040304; WO 2004018349 A3 20050120; WO 2004018349 A9 20040603; WO 2004018349 B1 20050324

DOCDB simple family (application)

FR 0210571 A 20020826; AU 2003276377 A 20030825; CA 2496320 A 20030825; EP 03792450 A 20030825; FR 0350036 W 20030825; JP 2004530314 A 20030825; US 52456005 A 20050214