EP 1553700 A3 20070328 - Surface acoustic wave device
Title (en)
Surface acoustic wave device
Title (de)
Oberflächenwellenvorrichtung
Title (fr)
Dispositif à ondes acoustiques de surface
Publication
Application
Priority
JP 2004002927 A 20040108
Abstract (en)
[origin: EP1553700A2] The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of a spiral inductor provided on a chip of the device. In one embodiment, the chip (8) on which the spiral inductor (2) is formed is flip-chip mounted in a package (9) together with a surface acoustic wave device chip in a region (15, 16). The package (9) is provided with a hermetically sealed lid (91). A conductor pattern (9a, 9b) is formed on a face of the package that opposes the spiral inductor (2). Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
IPC 8 full level
H03H 9/25 (2006.01); H03H 9/72 (2006.01); H01L 21/02 (2006.01); H01L 23/64 (2006.01); H03H 3/10 (2006.01); H03H 7/01 (2006.01); H03H 7/18 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/64 (2006.01); H01F 5/00 (2006.01); H01F 27/29 (2006.01)
CPC (source: EP KR US)
H01F 17/0006 (2013.01 - EP US); H03H 9/0576 (2013.01 - EP US); H03H 9/725 (2013.01 - EP US); H04M 1/60 (2013.01 - KR); H04R 1/1016 (2013.01 - KR); H01F 5/003 (2013.01 - EP US); H01F 27/29 (2013.01 - EP US); H01F 2017/0046 (2013.01 - EP US); H01L 23/5227 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H03H 2001/0078 (2013.01 - EP US)
Citation (search report)
- [YA] EP 0694932 A1 19960131 - PLESSEY SEMICONDUCTORS LTD [GB]
- [YA] EP 0809289 A2 19971126 - HARRIS CORP [US]
- [A] US 6159817 A 20001212 - ALTIMARI ROBERT J [US], et al
- [YA] US 6489656 B1 20021203 - LIN MOU-SHIUNG [TW]
- [A] US 6180445 B1 20010130 - TSAI CHAO-CHIEH [TW]
- [Y] US 2003132817 A1 20030717 - NAGAI TATSURO [JP]
- [A] EP 1154571 A1 20011114 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [X] DE 19712065 A1 19980423 - FUJITSU LTD [JP]
- [Y] US 6310386 B1 20011030 - SHENOY JAYARAMA N [US]
- [A] PANG A J ET AL: "Flip chip assembly of MEMS inductors", ELECTRONICS PACKAGING TECHNOLOGY, 2003 5TH CONFERENCE (EPTC 2003) DEC. 10-12, 2003, PISCATAWAY, NJ, USA,IEEE, 10 December 2003 (2003-12-10), pages 298 - 300, XP010687485, ISBN: 0-7803-8205-6
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR LV MK YU
DOCDB simple family (publication)
EP 1553700 A2 20050713; EP 1553700 A3 20070328; EP 1553700 B1 20110727; CN 1638274 A 20050713; CN 1638274 B 20110615; JP 2005198073 A 20050721; JP 4291164 B2 20090708; KR 100614171 B1 20060825; KR 20050073401 A 20050713; US 2006022767 A1 20060202; US 7102462 B2 20060905
DOCDB simple family (application)
EP 05250051 A 20050107; CN 200510000563 A 20050107; JP 2004002927 A 20040108; KR 20050001314 A 20050106; US 2476904 A 20041230