Global Patent Index - EP 1554109 B1

EP 1554109 B1 20060705 - DEVICE FOR PUNCHING, STAMPING AND/OR SHAPING FLAT ELEMENTS

Title (en)

DEVICE FOR PUNCHING, STAMPING AND/OR SHAPING FLAT ELEMENTS

Title (de)

VORRICHTUNG ZUM STANZEN, PRÄGEN UND/ODER VERFORMEN FLACHER ELEMENTE

Title (fr)

DISPOSITIF POUR ESTAMPER, MATRICER ET/OU DEFORMER DES ELEMENTS PLATS

Publication

EP 1554109 B1 20060705 (DE)

Application

EP 03753543 A 20031011

Priority

  • DE 10248859 A 20021018
  • DE 10337864 A 20030818
  • EP 0311287 W 20031011

Abstract (en)

[origin: US7353685B2] A device for punching, stamping and/or shaping flat elements ( 29 ) includes a base body ( 1 ) with a table ( 18 ) and support ( 26 ) for the flat element ( 29 ), and a base plate ( 17 ), which supports a punch ( 24 ), and which is advanced with a drive ( 4,5 ) toward the support ( 26 ) and into a working station (II), bringing the punch ( 24 ) into contact with the support ( 26 ). A large number of successive, very short, highly precise, punching strokes make punched holes or stampings. Short stop periods and short clock times are used for fast moving flat elements ( 29 ). Transfer apparatus ( 9, 7; 35; 43; 46 ) coupled between the drive ( 4,5 ) and the base plate ( 17 ) move the base plate ( 17 ) without building up pressure from a position of rest (I) The punch ( 24 ) is not in contact with the support ( 26 ), up to immediately in front of working position (II). The base plate ( 17 ) is then moved into working position (II) while producing a high pressure between the base plate ( 17 ) and the flat element ( 29 ). During further operation of the drive ( 4,5 ), the base plate ( 17 ) is returned to the position of rest (I,II) without building up pressure.

IPC 8 full level

B30B 1/16 (2006.01); B26D 5/14 (2006.01); B26D 5/16 (2006.01); B26D 5/18 (2006.01); B26F 1/08 (2006.01); B30B 1/10 (2006.01); B30B 1/26 (2006.01)

CPC (source: EP US)

B26D 5/14 (2013.01 - EP US); B26D 5/16 (2013.01 - EP US); B26D 5/18 (2013.01 - EP US); B26F 1/08 (2013.01 - EP US); B30B 1/14 (2013.01 - EP US); B30B 1/16 (2013.01 - EP US); B30B 1/261 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004037527 A2 20040506; WO 2004037527 A3 20040701; AT E332228 T1 20060715; AU 2003271715 A1 20040513; BR 0313551 A 20050712; BR 0313551 B1 20140429; DE 50304160 D1 20060817; EP 1554109 A2 20050720; EP 1554109 B1 20060705; ES 2266850 T3 20070301; JP 2006502866 A 20060126; RU 2005115118 A 20070110; RU 2338645 C2 20081120; US 2006021526 A1 20060202; US 7353685 B2 20080408

DOCDB simple family (application)

EP 0311287 W 20031011; AT 03753543 T 20031011; AU 2003271715 A 20031011; BR 0313551 A 20031011; DE 50304160 T 20031011; EP 03753543 A 20031011; ES 03753543 T 20031011; JP 2005501516 A 20031011; RU 2005115118 A 20031011; US 52448305 A 20050316