EP 1554357 A1 20050720 - POLISHING SLURRY AND POLISHED SUBSTRATE
Title (en)
POLISHING SLURRY AND POLISHED SUBSTRATE
Title (de)
POLIERSUSPENSION UND POLIERTES SUBSTRAT
Title (fr)
PATE DE POLISSAGE ET SUBSTRAT POLI
Publication
Application
Priority
- JP 0313641 W 20031024
- JP 2002311212 A 20021025
Abstract (en)
[origin: WO2004037943A1] A polishing slurry comprising an abrasive comprising as a basic ingredient rare earth oxides containing cerium oxide, which polishing slurry further comprises an anionic surfactant and a nonionic surfactant and has a pH value of at least 11. The polishing slurry is especially suitable for polishing a glass substrate for magnetic disc, and other substrates used in electronic field.
IPC 1-7
IPC 8 full level
B24B 1/00 (2006.01); B24D 3/02 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/768 (2006.01)
CPC (source: EP US)
C09G 1/02 (2013.01 - EP US); C09K 3/1463 (2013.01 - EP US)
Citation (search report)
See references of WO 2004037943A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004037943 A1 20040506; AU 2003275655 A1 20040513; EP 1554357 A1 20050720; US 2005287931 A1 20051229
DOCDB simple family (application)
JP 0313641 W 20031024; AU 2003275655 A 20031024; EP 03758887 A 20031024; US 53280205 A 20050425