EP 1555335 B1 20100317 - Additive for plating bath
Title (en)
Additive for plating bath
Title (de)
Zusatz für Plattierungsbad
Title (fr)
Additif pour bain de placage
Publication
Application
Priority
JP 2004009284 A 20040116
Abstract (en)
[origin: EP1555335A2] A plating bath additive and a plating bath using the said additive are provided, which plating bath contains a hydroxyalkanesulfonic acid and which even when applied to an electronic part such as a semiconductor device does not give rise to a problem such as circuit-to-circuit insulation becoming defective. The plating bath additive contains a hydroxyalkanesulfonic acid as a main component and has an alkali metal content of less than 0.05 mass% relative to the hydroxyalkanesulfonic acid. The plating bath incorporates the said additive therein.
IPC 8 full level
C23C 18/16 (2006.01); C25D 3/00 (2006.01); C25D 3/02 (2006.01); C25D 3/32 (2006.01); C25D 7/12 (2006.01); C25D 21/14 (2006.01)
CPC (source: EP KR US)
C23C 18/16 (2013.01 - EP US); C23C 18/31 (2013.01 - EP US); C25D 3/00 (2013.01 - KR); C25D 3/02 (2013.01 - EP KR US); C25D 3/32 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1555335 A2 20050720; EP 1555335 A3 20070620; EP 1555335 B1 20100317; CN 1670259 A 20050921; DE 602005019930 D1 20100429; JP 2005200714 A 20050728; KR 20050075692 A 20050721; TW 200536955 A 20051116; US 2005155514 A1 20050721
DOCDB simple family (application)
EP 05250172 A 20050114; CN 200510003975 A 20050114; DE 602005019930 T 20050114; JP 2004009284 A 20040116; KR 20050000663 A 20050105; TW 94100656 A 20050110; US 3584705 A 20050114