EP 1556909 A1 20050727 - VERTICAL INTEGRATED COMPONENT, COMPONENT ARRANGEMENT AND METHOD FOR PRODUCTION OF A VERTICAL INTEGRATED COMPONENT
Title (en)
VERTICAL INTEGRATED COMPONENT, COMPONENT ARRANGEMENT AND METHOD FOR PRODUCTION OF A VERTICAL INTEGRATED COMPONENT
Title (de)
VERTIKAL INTEGRIERTES BAUELEMENT, BAUELEMENT-ANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINES VERTIKAL INTEGRIERTEN BAUELEMENTS
Title (fr)
COMPOSANT INTEGRE VERTICAL, ENSEMBLE DE COMPOSANTS ET PROCEDE DE FABRICATION D'UN COMPOSANT INTEGRE VERTICAL
Publication
Application
Priority
- DE 0303587 W 20031029
- DE 10250868 A 20021031
Abstract (en)
[origin: WO2004040666A1] The invention relates to a vertical integrated component, a component arrangement and a method for production of a vertical integrated component. The vertical integrated component has a first electrical conducting layer (101), a mid layer (102), partly embodied from dielectric material on the first electrical conducting layer, a second electrical conducting layer (103) on the mid layer and a nanostructure (104) integrated in a through hole introduced in the mid layer with a first end section coupled to the first electrical conducting layer and a second end section coupled to the second electrical conducting layer. The mid layer comprises a third electrical conducting layer (105) between two adjacent dielectric partial layers (102a, 102b) the thickness of which is less than the thickness of at least one of the dielectric partial layers.
IPC 1-7
H01L 51/20; H01L 51/30; H01L 29/786; H01L 21/335; H01L 29/775
IPC 8 full level
B82B 1/00 (2006.01); H01L 21/335 (2006.01); H01L 21/336 (2006.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 51/30 (2006.01); H01L 27/28 (2006.01); H01L 51/00 (2006.01)
CPC (source: EP US)
B82Y 10/00 (2013.01 - EP US); H01L 29/0673 (2013.01 - EP US); H01L 29/0676 (2013.01 - EP US); H01L 29/66439 (2013.01 - EP US); H01L 29/66742 (2013.01 - EP US); H01L 29/66787 (2013.01 - EP US); H01L 29/775 (2013.01 - EP US); H01L 29/78642 (2013.01 - EP US); H10K 10/462 (2023.02 - EP US); H10K 19/10 (2023.02 - EP US); H10K 85/221 (2023.02 - EP US); H10K 85/615 (2023.02 - EP US)
Citation (search report)
See references of WO 2004040666A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004040666 A1 20040513; DE 10250868 A1 20040519; DE 10250868 B4 20080306; DE 10250868 B8 20080626; EP 1556909 A1 20050727; US 2006128088 A1 20060615; US 7709827 B2 20100504
DOCDB simple family (application)
DE 0303587 W 20031029; DE 10250868 A 20021031; EP 03778239 A 20031029; US 53355005 A 20051117