Global Patent Index - EP 1557240 A1

EP 1557240 A1 20050727 - Process and device for water jet cutting

Title (en)

Process and device for water jet cutting

Title (de)

Verfahren und Vorrichtung zum Wasserstrahlschneiden

Title (fr)

Procédé et dispositif pour le découpage au jet d'eau

Publication

EP 1557240 A1 20050727 (DE)

Application

EP 04100250 A 20040123

Priority

EP 04100250 A 20040123

Abstract (en)

To cut through workpieces (5) with a high pressure focused water jet (4), containing solid particles, the workpiece is immersed in a water bath (2) by the workpiece holder system (6-10), with its upper surface over the water level (1). The jet stream from the jet head (3) passes through the walls of the workpiece, and is caught in the bath.

Abstract (de)

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Wasserstrahlschneiden, bei dem/der das Werkstück 5 so in einem Wasserbad 2 gehalten wird, dass es zu einem wesentlichen Teil eingetaucht ist. <IMAGE>

IPC 1-7

B24C 1/04

IPC 8 full level

B24C 1/04 (2006.01)

CPC (source: EP)

B24C 1/045 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1557240 A1 20050727

DOCDB simple family (application)

EP 04100250 A 20040123