EP 1557704 A3 20050803 - Heatsinking of optical subassembly and method of assembling
Title (en)
Heatsinking of optical subassembly and method of assembling
Title (de)
Kühlkörperelement für optische Baugruppe und Zusammenbauverfahren
Title (fr)
Elément de refroidissement pour un module optique et méthode d'assemblage
Publication
Application
Priority
US 76110604 A 20040120
Abstract (en)
[origin: EP1557704A2] An optical transceiver has a housing (12), a circuit board (14), an optical subassembly (15,16) and a heat wick (18). The circuit board (14) is configured to be received within the housing (12). The optical subassembly has a can and a barrel, and the optical subassembly is mechanically supported on the housing and electrically coupled to the circuit board. The heat wick (18) is thermally coupled between the can of the optical assembly and the housing. <??>The housing includes a slot through which the flange of the heat wick extends, and wherein the flange is bent over onto a surface of the housing to thermally couple the heat wick to the housing. <IMAGE>
IPC 1-7
IPC 8 full level
G02B 6/42 (2006.01)
CPC (source: EP US)
G02B 6/4201 (2013.01 - EP US); G02B 6/4246 (2013.01 - EP US); G02B 6/4256 (2013.01 - EP US); G02B 6/4269 (2013.01 - EP US)
Citation (search report)
- [X] EP 0678765 A1 19951025 - IBM [US]
- [X] EP 1227349 A2 20020731 - AUTONETWORKS TECHNOLOGIES LTD [JP], et al
- [X] US 5032898 A 19910716 - BOWEN TERRY P [US], et al
- [X] US 4547039 A 19851015 - CARON BERNARD G [US], et al
- [A] US 6445475 B1 20020903 - OKUBORA AKIHIKO [JP], et al
- [A] US 6200041 B1 20010313 - GAIO DAVID P [US], et al
- [A] EP 1237025 A2 20020904 - SUMITOMO ELECTRIC INDUSTRIES [JP]
- [A] PATENT ABSTRACTS OF JAPAN vol. 005, no. 084 (P - 064) 2 June 1981 (1981-06-02)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1557704 A2 20050727; EP 1557704 A3 20050803; EP 1557704 B1 20150311; US 2005158052 A1 20050721; US 7308206 B2 20071211
DOCDB simple family (application)
EP 05075047 A 20050106; US 76110604 A 20040120