EP 1557872 A1 20050727 - PLASMA CHEMICAL VAPOR DEPOSITION METHOD
Title (en)
PLASMA CHEMICAL VAPOR DEPOSITION METHOD
Title (de)
VERFAHREN ZUR CHEMISCHEN PLASMADAMPFABLAGERUNG
Title (fr)
PROCEDE PLASMA CVD
Publication
Application
Priority
- JP 0313821 W 20031029
- JP 2002317539 A 20021031
Abstract (en)
A method for making the characteristics of the distribution of film thickness uniform is provided, avoiding generation of phase differences among streams of high-frequency electric power by manipulating the electrical characteristics of cables through which the high-frequency electric power is transmitted. Coaxial cables (19a to 19h and 24a to 24h) having a standard length and vacuum cables (20a to 20h and 25a to 25h) are installed, then a film is formed on a substrate by actually supplying high-frequency electric power, and thereafter the condition of vapor deposition such as the thickness of the film is observed. Based on the observations, the full lengths of the coaxial cables which communicate with the feeding points and the electrodes which correspond with positions over the substrate which need to be adjusted are changed. The coaxial cables are installed again, and high-frequency electric power equivalent to that used in the previous operation is supplied to form a film. The distribution of the film formed on the substrate is made uniform by repeating the above operations. <IMAGE>
IPC 1-7
IPC 8 full level
C23C 16/509 (2006.01); H01J 37/32 (2006.01); H01L 21/205 (2006.01)
CPC (source: EP US)
C23C 16/509 (2013.01 - EP US); H01J 37/32082 (2013.01 - EP US); H01J 37/32174 (2013.01 - EP US); H01J 37/32577 (2013.01 - EP US)
Designated contracting state (EPC)
CH DE GB LI
DOCDB simple family (publication)
EP 1557872 A1 20050727; EP 1557872 A4 20080409; EP 1557872 B1 20091216; DE 60330593 D1 20100128; JP 2004153071 A 20040527; JP 3902113 B2 20070404; US 2005272261 A1 20051208; US 7833587 B2 20101116; WO 2004040631 A1 20040513
DOCDB simple family (application)
EP 03769934 A 20031029; DE 60330593 T 20031029; JP 0313821 W 20031029; JP 2002317539 A 20021031; US 51837104 A 20041228