Global Patent Index - EP 1563520 A1

EP 1563520 A1 20050817 - ELECTRICAL CONTACT BETWEEN THIN VARNISHED WIRES OF THE SECONDARY WINDING OF AN IGNITION COIL

Title (en)

ELECTRICAL CONTACT BETWEEN THIN VARNISHED WIRES OF THE SECONDARY WINDING OF AN IGNITION COIL

Title (de)

ELEKTRISCHE KONTAKTIERUNG DÜNNER LACKDRÄHTE VON SEKUNDÄRWICKLUNGEN VON ZÜNDSPULEN

Title (fr)

ETABLISSEMENT D'UN CONTACT ELECTRIQUE ENTRE DES FILS LAQUES FINS D'ENROULEMENTS SECONDAIRES DE BOBINES D'ALLUMAGE

Publication

EP 1563520 A1 20050817 (DE)

Application

EP 03762341 A 20030725

Priority

  • DE 0302513 W 20030725
  • DE 10251841 A 20021107

Abstract (en)

[origin: WO2004042749A1] The invention relates to an electric connection system for producing an ignition coil. The aim of the invention is to substitute conventional methods like thermal methods for contacting thin varnished wires of ignition coils therebetween. The inventive method consists in placing a contact blade (8) on the side of a low voltage output (N) and guiding it above corresponding secondary windings without contacting it and in blocking said blade by latching according to the elasticity or position thereof. Elements arranged on the contact blade (8) punch the insulation layer which encompasses the secondary winding, thereby making it possible to produce an electrical connection without using thermal methods.

IPC 1-7

H01F 38/12; H01F 5/04; H01F 41/10

IPC 8 full level

H01F 5/04 (2006.01); H01F 38/12 (2006.01); H01F 41/10 (2006.01); H01F 27/28 (2006.01)

CPC (source: EP US)

H01F 5/04 (2013.01 - EP US); H01F 38/12 (2013.01 - EP US); H01F 41/10 (2013.01 - EP US); H01F 27/2828 (2013.01 - EP US); Y10T 29/4902 (2015.01 - EP US)

Citation (search report)

See references of WO 2004042749A1

Designated contracting state (EPC)

DE FR IT

DOCDB simple family (publication)

WO 2004042749 A1 20040521; DE 10251841 A1 20040519; EP 1563520 A1 20050817; EP 1563520 B1 20150520; JP 2006505925 A 20060216; JP 4575164 B2 20101104; US 2006211292 A1 20060921; US 7305751 B2 20071211

DOCDB simple family (application)

DE 0302513 W 20030725; DE 10251841 A 20021107; EP 03762341 A 20030725; JP 2004549045 A 20030725; US 53184103 A 20030725