EP 1563534 A1 20050817 - METHOD FOR ELECTRODEPOSITING A METAL, ESPECIALLY COPPER, USE OF SAID METHOD AND INTEGRATED CIRCUIT
Title (en)
METHOD FOR ELECTRODEPOSITING A METAL, ESPECIALLY COPPER, USE OF SAID METHOD AND INTEGRATED CIRCUIT
Title (de)
VERFAHREN ZUM GALVANISCHEN AUFBRINGEN EINES METALLS, INSBESONDERE VON KUPFER, VERWENDUNG DIESES VERFAHRENS UND INTEGRIERTE SCHALTUNGSANORDNUNG
Title (fr)
PROCEDE D'APPLICATION GALVANIQUE D'UN METAL, NOTAMMENT DE CUIVRE, UTILISATION DE CE PROCEDE ET CIRCUIT INTEGRE
Publication
Application
Priority
- DE 0303845 W 20031120
- DE 10254815 A 20021123
Abstract (en)
[origin: WO2004049431A1] The invention relates inter alia to a method wherein a contact hole for a conductor (14) is produced in an insulating layer (16). A barrier layer (20) is then applied, followed by a photo-lacquer layer (30) which is applied, irradiated and developed. A galvanic method is subsequently used to produce a copper contact (32) in the contact hole (18). The barrier layer (20) or an additional boundary electrode layer (22) is used as a boundary electrode in the galvanic process. Said method enables critical metal contaminations to be kept to a minimum during manufacturing.
IPC 1-7
IPC 8 full level
H01L 21/768 (2006.01)
CPC (source: EP)
H01L 21/76843 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01)
Citation (search report)
See references of WO 2004049431A1
Citation (examination)
WIDMANN D.; MADER H.; FRIEDRICH H.: "Technologie hochintegrierter Schaltungen", 1996, SPRINGER-VERLAG
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
WO 2004049431 A1 20040610; CN 100585830 C 20100127; CN 1714438 A 20051228; DE 10254815 A1 20040609; EP 1563534 A1 20050817; EP 2028686 A1 20090225; EP 2028686 B1 20120808; EP 2128899 A1 20091202; JP 2006507675 A 20060302; JP 4246706 B2 20090402; TW 200419715 A 20041001; TW I272695 B 20070201
DOCDB simple family (application)
DE 0303845 W 20031120; CN 200380103962 A 20031120; DE 10254815 A 20021123; EP 03767441 A 20031120; EP 08167849 A 20031120; EP 09170565 A 20031120; JP 2004554209 A 20031120; TW 92132086 A 20031114