EP 1567034 A4 20071114 - SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING A PERFORMANCE FILM
Title (en)
SEMICONDUCTOR COMPONENT HANDLING DEVICE HAVING A PERFORMANCE FILM
Title (de)
HALBLEITERKOMPONENTENHANDHABUNGSEINRICHTUNG MIT EINEM PERFORMANCE-FILM
Title (fr)
DISPOSITIF DE MANIPULATION DE COMPOSANTS A SEMI-CONDUCTEURS COMPRENANT UN FILM AMELIORANT LA PERFORMANCE
Publication
Application
Priority
- US 0237860 W 20021126
- US 33368901 P 20011127
Abstract (en)
[origin: WO03046950A2] The present invention relates generally to a system and method for including a thin protective containment thermopolymer film, such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.
IPC 8 full level
A47G 19/08 (2006.01); B65D 85/86 (2006.01); B29C 45/14 (2006.01); B65H 1/28 (2006.01); H01L 21/673 (2006.01); H01L 21/68 (2006.01); B29K 101/12 (2006.01); B29L 9/00 (2006.01)
CPC (source: EP KR US)
H01L 21/67323 (2013.01 - EP US); H01L 21/6733 (2013.01 - EP US); H01L 21/67346 (2013.01 - EP US); H01L 21/67366 (2013.01 - EP US); H01L 21/68 (2013.01 - KR)
Citation (search report)
- [X] EP 0342930 A2 19891123 - MITSUI TOATSU CHEMICALS [JP]
- [DX] DE 19924182 A1 19991202 - FLUOROWARE INC [US]
- [E] WO 03046952 A2 20030605 - ENTEGRIS INC [US], et al & US 6428729 B1 20020806 - BHATT SANJIV M [US], et al
- See references of WO 03046950A2
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 03046950 A2 20030605; WO 03046950 A3 20050602; AU 2002346528 A1 20030610; AU 2002346528 A8 20030610; CN 1636275 A 20050706; EP 1567034 A2 20050831; EP 1567034 A4 20071114; JP 2005521236 A 20050714; KR 20040062643 A 20040707; TW 200300996 A 20030616; US 2005236110 A1 20051027
DOCDB simple family (application)
US 0237860 W 20021126; AU 2002346528 A 20021126; CN 02827529 A 20021126; EP 02784595 A 20021126; JP 2003548277 A 20021126; KR 20047007895 A 20021126; TW 91134457 A 20021127; US 49675405 A 20050601