EP 1567606 A1 20050831 - A CORROSION RETARDING POLISHING SLURRY FOR THE CHEMICAL MECHANICAL POLISHING OF COPPER SURFACES
Title (en)
A CORROSION RETARDING POLISHING SLURRY FOR THE CHEMICAL MECHANICAL POLISHING OF COPPER SURFACES
Title (de)
KORROSIONSVERZÖGERNDE POLIERSUSPENSION ZUR CHEMISCH-MECHANISCHEN POLITUR VON KUPFERFLÄCHEN
Title (fr)
PATE A POLIR RETARDANT LA CORROSION DESTINEE A ETRE UTILISEE POUR LE POLISSAGE MECANO-CHIMIQUE DE SURFACES DE CUIVRE
Publication
Application
Priority
- US 0332691 W 20031014
- US 42037102 P 20021022
Abstract (en)
[origin: WO2004037937A1] The present invention provides a slurry for chemical mechanical polishing (CMP) a metal surface of a semiconductor substrate with a polyurethane-free thermoplastic foam polishing body. The slurry includes an abrasive particle stabilizer and an acid buffer that maintains the slurry at a pH between about 2.5 and about 4.0 during polishing of a metal surface on a semiconductor substrate. In yet another embodiment, the present invention provides a CMP polishing system. The polishing system comprises a slurry that maintains a pH between about 1 and about 6 during polishing of a metal surface on a semiconductor substrate. The System further includes a polishing pad that includes a polishing body having a polyurethane-free thermoplastic foam substrate that cooperates with the slurry to remove portions of the metal surface during said polishing.
IPC 1-7
IPC 8 full level
B24B 37/04 (2012.01); B24B 57/02 (2006.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP)
B24B 37/0056 (2013.01); B24B 37/04 (2013.01); B24B 57/02 (2013.01); C09G 1/02 (2013.01); H01L 21/3212 (2013.01)
Citation (search report)
See references of WO 2004037937A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004037937 A1 20040506; AU 2003282852 A1 20040513; CN 1705725 A 20051207; EP 1567606 A1 20050831; JP 2006504270 A 20060202
DOCDB simple family (application)
US 0332691 W 20031014; AU 2003282852 A 20031014; CN 200380101871 A 20031014; EP 03774847 A 20031014; JP 2004546879 A 20031014