EP 1570713 A1 20050907 - PRINTED WIRING BOARDS HAVING LOW INDUCTANCE EMBEDDED CAPACITORS AND METHODS OF MAKING SAME
Title (en)
PRINTED WIRING BOARDS HAVING LOW INDUCTANCE EMBEDDED CAPACITORS AND METHODS OF MAKING SAME
Title (de)
LEITERPLATTEN MIT EINGEBETTETEN KONDENSATOREN NIEDRIGERINDUKTIVITÄT UND HERSTELLUNGSVERFAHREN
Title (fr)
CARTES IMPRIMEES EQUIPEES DE CONDENSATEURS ENCASTRES A FAIBLE INDUCTANCE ET PROCEDES DE FABRICATION CORRESPONDANTS
Publication
Application
Priority
- US 0340326 W 20031212
- US 44310502 P 20021213
- US 66355103 A 20030916
Abstract (en)
[origin: WO2004056160A1] A printed wiring board (PWB) has stacked innerlayer panels (1001, 1002, 1003, ...) comprised of passive circuit elements (105). The passive elements (105) can include capacitors with electrode terminations located within the footprints of the capacitor electrodes (170, 180). The capacitor terminations are therefore closely spaced, reducing the capacitors' contributions to loop inductance in the innerlayer. Capacitor terminations within the electrode footprints also reduce the PWB board surface area used in forming the capacitors. The capacitor terminations are connected by circuit conductors (1021, 1022).
IPC 1-7
IPC 8 full level
H05K 1/16 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP KR)
H05K 1/16 (2013.01 - KR); H05K 1/162 (2013.01 - EP); H05K 3/46 (2013.01 - KR); H05K 3/429 (2013.01 - EP); H05K 3/4611 (2013.01 - EP); H05K 3/4623 (2013.01 - EP); H05K 2201/0355 (2013.01 - EP); H05K 2201/09509 (2013.01 - EP); H05K 2201/09718 (2013.01 - EP); H05K 2201/09763 (2013.01 - EP)
Citation (search report)
See references of WO 2004056160A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004056160 A1 20040701; EP 1570713 A1 20050907; JP 2006510233 A 20060323; KR 100713731 B1 20070504; KR 20050084258 A 20050826
DOCDB simple family (application)
US 0340326 W 20031212; EP 03813475 A 20031212; JP 2005508337 A 20031212; KR 20057010657 A 20050610