EP 1570951 A3 20060405 - Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units
Title (en)
Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units
Title (de)
Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer and damit erhaltene elektronische Bauteile
Title (fr)
Procédé de production de plaquettes semiconductrices comprenant des surfaces pauvres en défauts, l'utilisation de telles plaquettes et les ensembles électroniques ainsi obtenus
Publication
Application
Priority
DE 102004010379 A 20040303
Abstract (en)
[origin: EP1570951A2] The method involves polishing the surface with a polishing tool (40,60)) in constantly changing different polishing directions so that each place of the surface is covered statistically uniformly in each direction of a 360 degree complete angle. Independent claim describes substrate wafer for defect-free semi conductor component polished as above. Independent claim describes use of wafer (10) for manufacturing electronic components using high energy and high temperature technology. Independent claim describes electronic semiconductor component comprising substrate and one or more defect-free layers of semi conductor materials arranged thereon.
IPC 8 full level
B24B 1/00 (2006.01); B24B 37/04 (2012.01); H01L 21/304 (2006.01); H01S 5/02 (2006.01)
CPC (source: EP US)
B24B 37/042 (2013.01 - EP US); B24B 37/30 (2013.01 - EP US)
Citation (search report)
- [A] EP 0008360 A1 19800305 - IBM [US]
- [X] ANONYMOUS: "Method Of Polishing Semiconductor Wafers. September 1979.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 4, 1 September 1979 (1979-09-01), New York, US, pages 1453, XP002366198
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1570951 A2 20050907; EP 1570951 A3 20060405; CN 1684234 A 20051019; CN 1684234 B 20120801; DE 102004010379 A1 20050922; JP 2005260225 A 20050922; JP 5105711 B2 20121226; US 2005233679 A1 20051020; US 7367865 B2 20080506
DOCDB simple family (application)
EP 05004484 A 20050301; CN 200510071699 A 20050303; DE 102004010379 A 20040303; JP 2005055622 A 20050301; US 6911805 A 20050301