Global Patent Index - EP 1573804 A4

EP 1573804 A4 20060308 - METHODS OF FORMING STRUCTURE AND SPACER AND RELATED FINFET

Title (en)

METHODS OF FORMING STRUCTURE AND SPACER AND RELATED FINFET

Title (de)

VERFAHREN ZUR BILDUNG EINER STRUKTUR UND EINES ABSTANDSELEMENTS UND DIESBEZÜGLICHER FINFET

Title (fr)

PROCEDES DE FORMATION D'UNE STRUCTURE ET D'UN ESPACEUR, FINFET CORRESPONDANT

Publication

EP 1573804 A4 20060308 (EN)

Application

EP 02798557 A 20021219

Priority

US 0240869 W 20021219

Abstract (en)

[origin: WO2004059727A1] Methods for forming a spacer (44) for a first structure (24, 124), such as a gate structure of a FinFET, and at most a portion of a second structure (14), such as a fin, without detrimentally altering the second structure. The methods generate a first structure (24) having a top portion (30, 130) that overhangs an electrically conductive lower portion (32, 132) and a spacer (44) under the overhang (40, 140). The overhang (40, 140) may be removed after spacer processing. Relative to a FinFET, the overhang protects parts of the fin (14) such as regions adjacent and under the gate structure (24, 124) , and allows for exposing sidewalls of the fin (14) to other processing such as selective silicon growth and implantation. As a result, the methods allow sizing of the fin (14) and construction of the gate structure (24, 124) and spacer without detrimentally altering (e.g., eroding by forming a spacer thereon) the fin (14) during spacer processing. A FinFET (100) including a gate structure (24, 124) and spacer (44) is also disclosed.

IPC 8 full level

H01L 21/84 (2006.01); H01L 21/265 (2006.01); H01L 21/336 (2006.01); H01L 21/8234 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01)

CPC (source: EP)

H01L 21/26586 (2013.01); H01L 21/823437 (2013.01); H01L 29/42384 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR

DOCDB simple family (publication)

WO 2004059727 A1 20040715; AU 2002364088 A1 20040722; CN 1320641 C 20070606; CN 1714441 A 20051228; EP 1573804 A1 20050914; EP 1573804 A4 20060308; JP 2006511092 A 20060330; JP 4410685 B2 20100203

DOCDB simple family (application)

US 0240869 W 20021219; AU 2002364088 A 20021219; CN 02830043 A 20021219; EP 02798557 A 20021219; JP 2004563141 A 20021219