EP 1573809 A1 20050914 - SURFACE-MOUNTED MICROWAVE PACKAGE AND CORRESPONDING MOUNTING WITH MULTILAYER CIRCUIT
Title (en)
SURFACE-MOUNTED MICROWAVE PACKAGE AND CORRESPONDING MOUNTING WITH MULTILAYER CIRCUIT
Title (de)
AN DER OBERFLÄCHE ANGEBRACHTE MIKROWELLENKAPSELUNG UND ENTSPRECHENDE ANBRINGUNG MIT MEHRSCHICHTIGER SCHALTUNG
Title (fr)
BOITIER HYPERFREQUENCE A MONTAGE DE SURFACE ET MONTAGE CORRESPONDANT AVEC UN CIRCUIT MULTICOUCHE
Publication
Application
Priority
- EP 0350964 W 20031208
- FR 0216363 A 20021220
Abstract (en)
[origin: FR2849346A1] The hyperfrequency unit has a volume with an outer Faraday cage formed from a surface conductor. There is a connection point outside the Faraday cage and an input/output across the cage. There is a base forming a unit face with an outer surface forming a mounting surface to apply on the outer unit.
IPC 1-7
H01L 23/522; H01L 23/043; H01L 23/06; H01L 23/498; H01L 23/36
IPC 8 full level
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP US)
H01L 23/552 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H05K 1/0243 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 2223/6622 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/49175 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/1532 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US); H01L 2924/16315 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H05K 1/0219 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H05K 2201/10371 (2013.01 - EP US); H05K 2201/10477 (2013.01 - EP US); H05K 2201/10727 (2013.01 - EP US)
Citation (search report)
See references of WO 2004057670A1
Citation (examination)
US 6075700 A 20000613 - HOUGHTON CHRISTOPHER LEE [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2849346 A1 20040625; FR 2849346 B1 20061208; AU 2003299214 A1 20040714; EP 1573809 A1 20050914; JP 2006511071 A 20060330; US 2006071311 A1 20060406; US 7482678 B2 20090127; WO 2004057670 A1 20040708
DOCDB simple family (application)
FR 0216363 A 20021220; AU 2003299214 A 20031208; EP 0350964 W 20031208; EP 03799547 A 20031208; JP 2004561488 A 20031208; US 53973505 A 20050620