Global Patent Index - EP 1578552 A4

EP 1578552 A4 20061122 - DENSIFIED PARTICULATE/BINDER COMPOSITES

Title (en)

DENSIFIED PARTICULATE/BINDER COMPOSITES

Title (de)

VERDICHTETE PARTIKEL/BINDEMITTEL-VERBUNDWERKSTOFFE

Title (fr)

COMPOSITES DE PARTICULES/LIANT DENSIFIES

Publication

EP 1578552 A4 20061122 (EN)

Application

EP 03799883 A 20031209

Priority

  • US 0339287 W 20031209
  • US 43235602 P 20021209
  • US 47603803 P 20030605

Abstract (en)

[origin: WO2004052974A2] A system and method (Fig.1(a)-(f) to produce high density precision composite devices. A system and method to consolidate a high density composite within details of a mold (110). One method includes creating a densified composite within a mold (110). Another method includes densifying a pre-mixed composite within a mold (110). A very high density precision molded composite is formed.

IPC 8 full level

B22F 3/22 (2006.01); B22F 1/00 (2006.01); B22F 3/093 (2006.01); B22F 5/00 (2006.01); C22C 32/00 (2006.01); G21K 1/02 (2006.01)

IPC 8 main group level

C08K (2006.01)

CPC (source: EP US)

B22F 3/22 (2013.01 - EP US); C22C 32/0094 (2013.01 - EP US); G21K 1/025 (2013.01 - EP US); B22F 2998/00 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004052974 A2 20040624; WO 2004052974 A3 20040715; AU 2003299598 A1 20040630; AU 2003299598 A8 20040630; CA 2509416 A1 20040624; EP 1578552 A2 20050928; EP 1578552 A4 20061122; US 2005281701 A1 20051222

DOCDB simple family (application)

US 0339287 W 20031209; AU 2003299598 A 20031209; CA 2509416 A 20031209; EP 03799883 A 20031209; US 14847905 A 20050609