EP 1583632 A1 20051012 - EXPLOSIVELY BONDED COMPOSITE STRUCTURES AND METHOD OF PRODUCTION THEREOF
Title (en)
EXPLOSIVELY BONDED COMPOSITE STRUCTURES AND METHOD OF PRODUCTION THEREOF
Title (de)
EXPLOSIONSBINDE VERBUNDSTRUKTUR UND VERFAHREN ZU IHRER HERSTELLUNG
Title (fr)
STRUCTURES COMPOSITES A LIAISON EXPLOSIVE ET PROCEDE DE PRODUCTION
Publication
Application
Priority
- CA 0302027 W 20031230
- GB 0300014 A 20030102
Abstract (en)
[origin: WO2004060599A1] A process for the manufacture of an explosively-bonded composite structure (100) comprising a substrate (12), a metallic cladder (14) and an intervening interlayer (28) between the substrate (12) and the cladder (14), the cladder (14) and the interlayer (28) having a waveless interface therebetween, the process comprising (A) forming a non-bonded composite structure (100) comprising in combination, (a) a substrate (12) having a first side; (b) an interlayer (28) of a material compatible with the substrate (12), and having (i) a thickness Tl;(ii) a mass Ml; (iii) a first side adjacent to the substrate (12),and having (i) a thickness T1;(ii) a mass Ml; (iii) a first side adjacent to the substrate (12) at a distance Dl, therefrom; and (iv) a second side; (c) a cladder (14) having (i) a thickness TC;(ii) a mass MC; (iii) a first side adjacent to thesecond side of the interlayer (28) at a distance D2 therefrom; and (iv) a second side; and (d) an explosive mixture (16) adjacent the second side of the cladder (14); and wherein Dl is equal to or less than 2T1; D2 is equal to or less than TC; and MC is equal to or greater than Ml; and (B) detonating said explosive mixture (16). Tae method produces one or more totally flat interfaces,which avoids the formation of deleterious waves and the associated inherent problems of cracking and incorporated intermetallics. The method also allows of the use of thin interlayers (28), which is of value when such interlayer materials are expensive.
IPC 1-7
IPC 8 full level
B23K 20/08 (2006.01); B23K 20/227 (2006.01); B32B 15/01 (2006.01)
CPC (source: EP US)
B23K 20/08 (2013.01 - EP US); B23K 20/227 (2013.01 - EP US); B32B 15/013 (2013.01 - EP US); B32B 15/015 (2013.01 - EP US); B23K 2101/34 (2018.07 - EP US); B23K 2103/16 (2018.07 - EP US); B23K 2103/18 (2018.07 - EP US); B23K 2103/24 (2018.07 - EP US)
Citation (search report)
See references of WO 2004060599A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004060599 A1 20040722; AU 2003292941 A1 20040729; CA 2454849 A1 20040702; EP 1583632 A1 20051012; GB 0300014 D0 20030205; US 2004149806 A1 20040805
DOCDB simple family (application)
CA 0302027 W 20031230; AU 2003292941 A 20031230; CA 2454849 A 20031230; EP 03788742 A 20031230; GB 0300014 A 20030102; US 74711803 A 20031230