EP 1586005 A4 20090513 - HIGH SENSITIVITY RESIST COMPOSITIONS FOR ELECTRON-BASED LITHOGRAPHY
Title (en)
HIGH SENSITIVITY RESIST COMPOSITIONS FOR ELECTRON-BASED LITHOGRAPHY
Title (de)
HOCHEMPFINDLICHE RESISTZUSAMMENSETZUNGEN F R ELEKTRONENLITHOGRAPHIE
Title (fr)
COMPOSITIONS DE RESERVE DE HAUTE SENSIBILITE POUR LITHOGRAPHIE ELECTRONIQUE
Publication
Application
Priority
US 0239048 W 20021205
Abstract (en)
[origin: WO2004053594A2] The resist compositions having an acid sensitive imaging polymer and a radiation sensitive acid generator component comprising: (i) a first radiation sensitive acid generator selected from the group consisting of dissolution-inhibiting acid generators, and (ii) a second radiation sensitive acid generator selected from the group consisting of unprotected acidic group-functionalized acid generators and acid labile group-protected acidic group-functionalized radiation sensitive acid generators; enables formation of high sensitivity resists suitable for use in EPL, EUV, soft x-ray, and other low energy intensity lithographic imaging applications. The resist compositions may be useful in other lithographic processes as well.
IPC 8 full level
G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/30 (2006.01)
CPC (source: EP)
G03F 7/0045 (2013.01); G03F 7/0392 (2013.01)
Citation (search report)
- [X] US 5403695 A 19950404 - HAYASE RUMIKO [JP], et al
- [X] EP 1024406 A1 20000802 - WAKO PURE CHEM IND LTD [JP], et al
- [X] EP 0908473 A1 19990414 - SHINETSU CHEMICAL CO [JP]
- [YD] EP 0297442 A1 19890104 - BASF AG [DE]
- [YD] EP 0515079 A1 19921125 - AMERICAN TELEPHONE & TELEGRAPH [US]
- [Y] US 6043003 A 20000328 - BUCCHIGNANO JAMES J [US], et al
- [A] US 6365321 B1 20020402 - CHEN KUANG-JUNG [US], et al
- [A] EP 1167349 A1 20020102 - SUMITOMO CHEMICAL CO [JP]
- See references of WO 2004053594A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
WO 2004053594 A2 20040624; WO 2004053594 A3 20051124; AT E477517 T1 20100815; AU 2002351269 A1 20040630; CN 100578357 C 20100106; CN 1836191 A 20060920; DE 60237318 D1 20100923; EP 1586005 A2 20051019; EP 1586005 A4 20090513; EP 1586005 B1 20100811; JP 2006512600 A 20060413
DOCDB simple family (application)
US 0239048 W 20021205; AT 02786917 T 20021205; AU 2002351269 A 20021205; CN 02829997 A 20021205; DE 60237318 T 20021205; EP 02786917 A 20021205; JP 2004558994 A 20021205