Global Patent Index - EP 1590499 A3

EP 1590499 A3 20051214 - IMPROVED SILVER PLATING METHOD AND ARTICLES MADE THEREFROM

Title (en)

IMPROVED SILVER PLATING METHOD AND ARTICLES MADE THEREFROM

Title (de)

VERBESSERTES VERSILBERUNGSVERFAHREN UND DAMIT ERZEUGTE ARTIKEL

Title (fr)

PROCEDE AMELIORE DE PLAQUAGE DE L'ARGENT, ET ARTICLES AINSI REALISES

Publication

EP 1590499 A3 20051214 (EN)

Application

EP 03754690 A 20030919

Priority

  • US 0329293 W 20030919
  • US 41230102 P 20020920
  • US 41230202 P 20020920
  • US 41230302 P 20020920
  • US 41230602 P 20020920

Abstract (en)

[origin: WO2004027113A2] An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of Na4EDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.

IPC 1-7

C23C 18/00

IPC 8 full level

C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/44 (2006.01)

CPC (source: EP KR US)

C23C 18/00 (2013.01 - KR); C23C 18/1644 (2013.01 - EP US); C23C 18/1658 (2013.01 - EP US); C23C 18/2086 (2013.01 - EP US); C23C 18/285 (2013.01 - EP US); C23C 18/44 (2013.01 - EP US); Y10T 428/12556 (2015.01 - EP US); Y10T 428/12896 (2015.01 - EP US)

Citation (search report)

See references of WO 2004027113A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004027113 A2 20040401; WO 2004027113 A3 20051027; AU 2003272505 A1 20040408; CA 2539656 A1 20040401; EP 1590499 A2 20051102; EP 1590499 A3 20051214; JP 2006514713 A 20060511; KR 20050074951 A 20050719; US 2004173056 A1 20040909

DOCDB simple family (application)

US 0329293 W 20030919; AU 2003272505 A 20030919; CA 2539656 A 20030919; EP 03754690 A 20030919; JP 2004537944 A 20030919; KR 20057004857 A 20050321; US 66656803 A 20030919