EP 1594651 A1 20051116 - DEVICE AND METHOD FOR PROCESSING ELECTRIC CIRCUIT SUBSTRATES BY LASER
Title (en)
DEVICE AND METHOD FOR PROCESSING ELECTRIC CIRCUIT SUBSTRATES BY LASER
Title (de)
VORRICHTUNG UND VERFAHREN ZUR BEARBEITUNG VON ELEKTRISCHEN SCHALTUNGSSUBSTRATEN MITTELS LASER
Title (fr)
DISPOSITIF ET PROCEDE POUR TRAITER AU LASER DES SUBSTRATS DE COMMUTATION ELECTRIQUE
Publication
Application
Priority
- EP 0313314 W 20031126
- DE 10307309 A 20030220
Abstract (en)
[origin: US2004164057A1] For processing electric circuit substrates, a laser source with a diode-pumped. quality-controlled, pulsed solid-state laser is used. The laser is able to emit laser radiation with a wavelength between 266 nm and 1064 nm, a pulse repetition rate between 1 kHz and 1 MHz and a pulse length of 30 ns to 200 ns with an average laser power between 1 W and around 5 W. Pre-specified operating modes can be set via a controller, depending on an area of application, with the appropriate different combinations of laser power and repetition rate. Thus, the same laser can optionally be used to perform a drilling operation, an etch removal operation or an exposure operation. Using a galvo mirror deflector unit that can also be controlled via the deflection unit, the laser beam may be deflected on the substrate in accordance with the relevant operating mode.
IPC 1-7
IPC 8 full level
B23K 26/38 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
B23K 26/36 (2013.01 - KR); B23K 26/38 (2013.01 - KR); B23K 26/382 (2015.10 - EP US); B23K 26/40 (2013.01 - EP US); H05K 3/0038 (2013.01 - EP US); H05K 3/0082 (2013.01 - KR); B23K 2103/172 (2018.07 - EP US); B23K 2103/30 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US); H05K 3/0082 (2013.01 - EP US)
Citation (search report)
See references of WO 2004073917A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
US 2004164057 A1 20040826; US 6849823 B2 20050201; AU 2003294733 A1 20040909; CN 100448594 C 20090107; CN 1753755 A 20060329; DE 10307309 A1 20040909; DE 10307309 B4 20070614; EP 1594651 A1 20051116; JP 2006513862 A 20060427; KR 20050103951 A 20051101; WO 2004073917 A1 20040902
DOCDB simple family (application)
US 66391603 A 20030917; AU 2003294733 A 20031126; CN 200380109879 A 20031126; DE 10307309 A 20030220; EP 0313314 W 20031126; EP 03785671 A 20031126; JP 2004568402 A 20031126; KR 20057015447 A 20050820