Global Patent Index - EP 1597405 A1

EP 1597405 A1 20051123 - METHOD AND DEVICE FOR MELT DIP COATING METAL STRIPS, ESPECIALLY STEEL STRIPS

Title (en)

METHOD AND DEVICE FOR MELT DIP COATING METAL STRIPS, ESPECIALLY STEEL STRIPS

Title (de)

VERFAHREN UND EINRICHTUNG ZUM SCHMELZTAUCH-BESCHICHTEN VON METALLBÄNDERN, INSBESONDERE VON STAHLBÄNDERN

Title (fr)

PROCEDE ET DISPOSITIF DE GALVANISATION DE BANDES METALLIQUES, EN PARTICULIER DE BANDES D'ACIER

Publication

EP 1597405 A1 20051123 (DE)

Application

EP 04710805 A 20040213

Priority

  • EP 2004001341 W 20040213
  • DE 10308834 A 20030227
  • DE 10312939 A 20030322

Abstract (en)

[origin: WO2004076707A1] The invention relates to a method for melt dip coating a metal strip (1), especially a steel strip (1a), which is guided through a coating station (4). The metal strip (1) is coated with a coating metal (3), the metal strip (1) is centrally maintained in a guide channel (8) in an electromagnetic sealing field (13) which seals the guide channel (8) from below and guides the metal strip (1) laterally, counter to ferromagnetic attraction, through a corrector field (14). The sealing field (13) is embodied as an electromagnetic guiding field (10), as a blocking field (11) or as a pump field (12) in order to select adequate lateral sealing when any particular sealing field (13) is used. Several corrector fields (14) are arranged in a distributed manner in a selected configuration, whereby the position and number thereof are determined individually at least according to the various widths of the metal strip (1).

IPC 1-7

C23C 2/24

IPC 8 full level

C23C 2/24 (2006.01)

CPC (source: EP KR US)

C23C 2/00362 (2022.08 - KR); C23C 2/24 (2013.01 - EP KR US); C23C 2/40 (2013.01 - KR); C23C 2/50 (2022.08 - KR)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004076707 A1 20040910; AU 2004215221 A1 20040910; AU 2004215221 B2 20090611; BR PI0407909 A 20060214; CA 2517319 A1 20040910; EP 1597405 A1 20051123; JP 2006519306 A 20060824; JP 4518416 B2 20100804; KR 20050107456 A 20051111; MX PA05009170 A 20051020; PL 376865 A1 20060109; RU 2005130001 A 20060210; RU 2344197 C2 20090120; US 2007036908 A1 20070215

DOCDB simple family (application)

EP 2004001341 W 20040213; AU 2004215221 A 20040213; BR PI0407909 A 20040213; CA 2517319 A 20040213; EP 04710805 A 20040213; JP 2006501826 A 20040213; KR 20057015743 A 20050825; MX PA05009170 A 20040213; PL 37686504 A 20040213; RU 2005130001 A 20040213; US 54721504 A 20040213