EP 1597757 A2 20051123 - CONNECTION TECHNOLOGY FOR POWER SEMICONDUCTORS COMPRISING A LAYER OF ELECTRICALLY INSULATING MATERIAL THAT FOLLOWS THE SURFACE CONTOURS
Title (en)
CONNECTION TECHNOLOGY FOR POWER SEMICONDUCTORS COMPRISING A LAYER OF ELECTRICALLY INSULATING MATERIAL THAT FOLLOWS THE SURFACE CONTOURS
Title (de)
VERBINDUNGSTECHNIK FÜR LEISTUNGSHALBLEITER MIT EINER DER OBERFLÄCHENKONTUR FOLGENDEN SCHICHT AUS ELEKTRISCH ISOLIERENDEM MATERIAL
Title (fr)
TECHNIQUE DES CONNEXIONS DESTINEE A DES SEMI-CONDUCTEURS DE PUISSANCE ET UTILISANT UNE MATIERE ELECTRIQUEMENT ISOLANTE QUI SUIT LES CONTOURS DE SURFACE
Publication
Application
Priority
- EP 2004000629 W 20040126
- DE 10308978 A 20030228
Abstract (en)
[origin: WO2004077548A2] A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01)
CPC (source: EP US)
H01L 23/5389 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
See references of WO 2004077548A2
Citation (examination)
- JP H07193174 A 19950728 - MITSUBISHI ELECTRIC CORP
- EP 0747949 A2 19961211 - MOTOROLA INC [US]
- US 3099608 A 19630730 - RADOVSKY DAVID A, et al
Designated contracting state (EPC)
DE FR GB SE
DOCDB simple family (publication)
WO 2004077548 A2 20040910; WO 2004077548 A3 20050512; CN 100499053 C 20090610; CN 1757103 A 20060405; EP 1597757 A2 20051123; JP 2006514785 A 20060511; JP 4763463 B2 20110831; US 2006192290 A1 20060831; US 2007216025 A1 20070920; US 7208347 B2 20070424; US 7855451 B2 20101221
DOCDB simple family (application)
EP 2004000629 W 20040126; CN 200480005533 A 20040126; EP 04705063 A 20040126; JP 2005518649 A 20040126; US 54717304 A 20040126; US 72890007 A 20070327