EP 1598863 A1 20051123 - SEMICONDUCTOR DEVICE AND RADIATION DETECTOR EMPLOYING IT
Title (en)
SEMICONDUCTOR DEVICE AND RADIATION DETECTOR EMPLOYING IT
Title (de)
HALBLEITERBAUELEMENT UND STRAHLUNGSDETEKTOR DAMIT
Title (fr)
DISPOSITIF SEMI-CONDUCTEUR ET DETECTEUR DE RAYONNEMENT UTILISANT CELUI-CI
Publication
Application
Priority
- JP 2004002291 W 20040226
- JP 2003051493 A 20030227
Abstract (en)
A wiring substrate to which a semiconductor element 10 is connected, is a wiring substrate 20 comprised of a glass substrate with through-hole groups 20d, each group consisting of a plurality of through holes 20c extending from input surface 20a to output surface 20b and formed in a predetermined array, and conductive members 21 formed on respective inner walls of the through holes 20c in each through-hole group 20d so as to establish electrical continuity between input surface 20a and output surface 20b. A bump electrode 12 of semiconductor element 10 connected to the input surface 20a corresponds to each through-hole group 20d, conductive member 21, and conductive part 22 formed in a region covering the through-hole group 20d, and is connected so that a portion of the bump electrode 12 enters into an interior of each of the through holes 20c. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it. <IMAGE>
IPC 1-7
H01L 21/60; A61B 6/03; G01T 1/20; G01T 1/24; H01L 23/12; H01L 27/146
IPC 8 full level
A61B 6/03 (2006.01); G01T 1/20 (2006.01); G01T 1/24 (2006.01); H01L 21/60 (2006.01); H01L 23/12 (2006.01); H01L 27/146 (2006.01); H01L 31/0232 (2006.01); H01L 31/09 (2006.01); H05K 3/34 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H05K 1/03 (2006.01)
CPC (source: EP KR US)
A61B 6/03 (2013.01 - KR); G01T 1/20 (2013.01 - KR); G01T 1/24 (2013.01 - KR); H01L 24/16 (2013.01 - EP US); H01L 27/1462 (2013.01 - EP US); H01L 27/14636 (2013.01 - EP US); H01L 31/02322 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H01L 23/15 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 27/14658 (2013.01 - EP US); H01L 27/14676 (2013.01 - EP US); H01L 2224/0345 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/0603 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/1403 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/16235 (2013.01 - EP US); H01L 2224/16237 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/04941 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/12043 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15312 (2013.01 - EP US); H01L 2924/15788 (2013.01 - EP US); H01L 2924/30105 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 2201/0979 (2013.01 - EP US); H05K 2203/0455 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 1598863 A1 20051123; EP 1598863 A4 20061213; EP 1598863 B1 20100818; CN 100407389 C 20080730; CN 1748300 A 20060315; DE 602004028707 D1 20100930; IL 170458 A 20110228; JP 2004265959 A 20040924; JP 3935091 B2 20070620; KR 20060022636 A 20060310; TW 200504898 A 20050201; US 2007075408 A1 20070405; US 7663113 B2 20100216; WO 2004077549 A1 20040910
DOCDB simple family (application)
EP 04714921 A 20040226; CN 200480003857 A 20040226; DE 602004028707 T 20040226; IL 17045805 A 20050823; JP 2003051493 A 20030227; JP 2004002291 W 20040226; KR 20057012528 A 20050701; TW 93105034 A 20040227; US 54669804 A 20040226