Global Patent Index - EP 1600516 A2

EP 1600516 A2 20051130 - Lead-free, free-cutting copper alloys

Title (en)

Lead-free, free-cutting copper alloys

Title (de)

Bleifreie Automatenkupferlegierung

Title (fr)

Alliage de cuivre de décolletage sans plomb

Publication

EP 1600516 A2 20051130 (EN)

Application

EP 05017190 A 19981116

Priority

  • EP 98953071 A 19981116
  • JP 28859098 A 19981012

Abstract (en)

The present invention relates to lead free, free cutting copper alloys and methods of their manufacture. In particular, the present invention is directed to a lead-free, free-cutting copper alloy which comprises 70 to 80 percent, by weight, of copper; 1.8 to 3.5 percent, by weight, of silicon; and at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminium, and 0.02 to 0.25 percent, by weight, of phosphorous; and the remaining percent, by weight, of zinc and wherein the metal structure of the free cutting copper alloy has at least one phase selected from the gamma (gamma) phase and the kappa (kappa) phase. <IMAGE>

IPC 1-7

C22C 9/04; C22F 1/08

IPC 8 full level

C22C 9/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP KR)

C22C 9/04 (2013.01 - EP KR); C22F 1/08 (2013.01 - EP)

Designated contracting state (EPC)

BE DE FI FR GB IT SE

DOCDB simple family (publication)

EP 1559802 A1 20050803; EP 1559802 B1 20140115; AU 1054199 A 20000501; AU 744335 B2 20020221; CA 2314144 A1 20000420; CA 2314144 C 20060822; DE 69832097 D1 20051201; DE 69832097 T2 20060706; DE 69838115 D1 20070830; DE 69838115 T2 20080410; DE 69839830 D1 20080911; DE 69840585 D1 20090402; EP 1045041 A1 20001018; EP 1045041 A4 20030507; EP 1045041 B1 20051026; EP 1600515 A2 20051130; EP 1600515 A3 20051214; EP 1600515 B1 20080730; EP 1600515 B8 20081015; EP 1600516 A2 20051130; EP 1600516 A3 20051214; EP 1600516 B1 20070718; EP 1600517 A2 20051130; EP 1600517 A3 20051214; EP 1600517 B1 20090218; JP 2000119775 A 20000425; JP 3734372 B2 20060111; KR 100352213 B1 20020912; KR 20010033073 A 20010425; TW 421674 B 20010211; WO 0022182 A1 20000420

DOCDB simple family (application)

EP 05075421 A 19981116; AU 1054199 A 19981116; CA 2314144 A 19981116; DE 69832097 T 19981116; DE 69838115 T 19981116; DE 69839830 T 19981116; DE 69840585 T 19981116; EP 05017189 A 19981116; EP 05017190 A 19981116; EP 05017191 A 19981116; EP 98953071 A 19981116; JP 28859098 A 19981012; JP 9805157 W 19981116; KR 20007006434 A 20000612; TW 88103879 A 19990312