EP 1604051 A1 20051214 - ELECTRODEPOSITION OF ALUMINUM AND REFRACTORY METALS FROM NON-AROMATIC ORGANIC SOLVENTS
Title (en)
ELECTRODEPOSITION OF ALUMINUM AND REFRACTORY METALS FROM NON-AROMATIC ORGANIC SOLVENTS
Title (de)
ELEKTROPLATTIERUNG VON ALUMINIUM UND REFRAKTÄRMETALLEN AUS EINER NICHTAROMATISCHEN ORGANISCHEN LÖSUNG
Title (fr)
ELECTRODEPOSITION D'ALUMINIUM ET METAUX REFRACTAIRES ELABORES A PARTIR DE SOLVANTS ORGANIQUES NON AROMATIQUES
Publication
Application
Priority
- CA 2004000328 W 20040305
- US 45163103 P 20030305
- US 79183504 A 20040304
Abstract (en)
[origin: US2004173468A1] An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous non-aromatic organic solvent. Electrodeposition of a metal from the electroplating solution includes preparing an electroplating solution and electrodepositing the metal from the electroplating solution onto a conductive substrate under a cathodic current. An electroplating system has a plating chamber containing an electroplating solution, an entry point to the electroplating system, and a transporting system to convey a part to be electroplated from the entry point to the plating chamber. The electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives, the mixture dissolved in the non-aqueous non-aromatic organic solvent.
IPC 1-7
IPC 8 full level
C25D 3/42 (2006.01); C25D 3/44 (2006.01); C25D 3/52 (2006.01); C25D 3/54 (2006.01)
CPC (source: EP US)
C25D 3/42 (2013.01 - EP US); C25D 3/44 (2013.01 - EP US); C25D 3/52 (2013.01 - EP US); C25D 3/54 (2013.01 - EP US)
Citation (search report)
See references of WO 2004079054A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2004173468 A1 20040909; BR PI0409064 A 20071204; CA 2517977 A1 20040916; EP 1604051 A1 20051214; JP 2006519312 A 20060824; RU 2005130772 A 20060210; WO 2004079054 A1 20040916
DOCDB simple family (application)
US 79183504 A 20040304; BR PI0409064 A 20040305; CA 2004000328 W 20040305; CA 2517977 A 20040305; EP 04717527 A 20040305; JP 2006504066 A 20040305; RU 2005130772 A 20040305