EP 1606841 A2 20051221 - ELECTRONIC COMPONENT COMPRISING A SEMICONDUCTOR CHIP AND A PLASTIC HOUSING, AND METHOD FOR PRODUCING THE SAME
Title (en)
ELECTRONIC COMPONENT COMPRISING A SEMICONDUCTOR CHIP AND A PLASTIC HOUSING, AND METHOD FOR PRODUCING THE SAME
Title (de)
ELEKTRONISCHES BAUTEIL MIT HALBLEITERCHIP UND KUNSTSTOFFGEHÄUSE UND VERFAHREN ZUR HERSTELLUNG DESSELBEN
Title (fr)
COMPOSANT ELECTRONIQUE COMPRENANT UNE PUCE SEMI-CONDUCTRICE ET UN BOITIER EN PLASTIQUE ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 2004000461 W 20040309
- DE 10310842 A 20030311
Abstract (en)
[origin: WO2004082018A2] The invention relates to an electronic component comprising a semiconductor chip (1). Said semiconductor chip (1) is contained in a plastic housing (6) in such a way that the rear side (3) and the lateral sides (4, 5) thereof are embedded in a plastic material (7). The lateral sides (4, 5) and/or the rear side (3) of the semiconductor chip (2) have an anchoring region (10) which enables the semiconductor chip (1) to positively engage with the surrounding plastic material (7). The invention also relates to a method for producing the inventive component.
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 23/3107 (2013.01 - EP US); H01L 23/3142 (2013.01 - EP US); H01L 29/0657 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/18301 (2013.01 - EP US)
Citation (search report)
See references of WO 2004082018A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004082018 A2 20040923; WO 2004082018 A3 20041111; DE 10310842 A1 20040930; DE 10310842 B4 20070405; EP 1606841 A2 20051221; US 2006255478 A1 20061116; US 7508083 B2 20090324
DOCDB simple family (application)
DE 2004000461 W 20040309; DE 10310842 A 20030311; EP 04718612 A 20040309; US 54885404 A 20040309