Global Patent Index - EP 1608788 A1

EP 1608788 A1 20051228 - OXYGEN-FREE COPPER ALLOY AND METHOD FOR ITS MANUFACTURE AND USE OF COPPER ALLOY

Title (en)

OXYGEN-FREE COPPER ALLOY AND METHOD FOR ITS MANUFACTURE AND USE OF COPPER ALLOY

Title (de)

SAUERSTOFFFREIE KUPFERLEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR UND VERWENDUNG VON KUPFERLEGIERUNG

Title (fr)

ALLIAGE DE CUIVRE EXEMPT D'OXYGENE ET SON PROCEDE DE FABRICATION ET L'UTILISATION DE L'ALLIAGE EN CUIVRE

Publication

EP 1608788 A1 20051228 (EN)

Application

EP 04725401 A 20040402

Priority

  • FI 2004000203 W 20040402
  • FI 20030508 A 20030403

Abstract (en)

[origin: WO2004087976A1] The invention relates to an oxygen-free copper alloy containing magnesium between 30 - 180 ppm, preferably 50 - 150 ppm in order to improve temperature resistance. The invention also relates to a method for the manufacture of the copper alloy and to the use of the copper alloy.

IPC 1-7

C22C 9/00

IPC 8 full level

C22C 9/00 (2006.01)

IPC 8 main group level

C22C (2006.01)

CPC (source: EP US)

C22C 9/00 (2013.01 - EP US)

Citation (search report)

See references of WO 2004087976A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004087976 A1 20041014; CN 1798854 A 20060705; EP 1608788 A1 20051228; FI 20030508 A0 20030403; TW 200426231 A 20041201; US 2006198757 A1 20060907

DOCDB simple family (application)

FI 2004000203 W 20040402; CN 200480008705 A 20040402; EP 04725401 A 20040402; FI 20030508 A 20030403; TW 93108493 A 20040329; US 55147705 A 20050929