EP 1610927 A2 20060104 - DEVICE FOR GRIPPING A SEMICONDUCTOR PLATE THROUGH A TRANSFER OPENING, USING THE CLOSURE OF THE OPENING
Title (en)
DEVICE FOR GRIPPING A SEMICONDUCTOR PLATE THROUGH A TRANSFER OPENING, USING THE CLOSURE OF THE OPENING
Title (de)
GERÄT ZUR HANDHABUNG VON HALBLEITERSCHEIBEN ZUM DURCHQUEREN EINER ÖFFNUNG BEI NUTZUNG DER VERSCHLUSSVORRICHTUNG DER ÖFFNUNG
Title (fr)
DISPOSITIF PERMETTANT LA PREHENSION D'UNE PLAQUE DE SEMI-CONDUCTEUR A TRAVERS UNE OUVERTURE DE TRANSFERT, UTILISANT L'OBTURATEUR DE L'OUVERTURE
Publication
Application
Priority
- FR 0303688 W 20031212
- US 43351602 P 20021213
Abstract (en)
[origin: WO2004054755A2] The invention concerns a device (1) for gripping, through a transfer station opening (10) for a semiconductor plate processing installation, at least one semiconductor plate (11) having the shape of a disc, housed inside a container (14) of semiconductor plates located on one first side (15) of said opening, from a space (16) located on a second side (17) of said opening opposite the first side. Said device comprises: a mobile closure (1) capable of moving between a first position closing said opening, and a second position releasing said opening allowing access inside the container; means for moving (18) said closure between said first and second positions thereof, said displacement being located at least partly in a plane substantially parallel to the plane of said opening. Said device is characterized in that it comprises: means for gripping (2) at least one semiconductor plate (11), capable of partly penetrating inside said container beneath a plate and of gripping the latter by its peripheral part; means for moving (3) said gripping means from said space located on the second side of the opening towards the first side, or inversely; means for connecting (4) to said closure said means for moving the gripping means.
IPC 1-7
IPC 8 full level
B23Q 7/04 (2006.01); B23Q 11/08 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP US)
B23Q 7/043 (2013.01 - EP US); B23Q 11/08 (2013.01 - EP US); H01L 21/67766 (2013.01 - EP US); H01L 21/68707 (2013.01 - EP US); Y10S 414/135 (2013.01 - EP US)
Citation (search report)
See references of WO 2004054755A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004054755 A2 20040701; WO 2004054755 A3 20041021; AU 2003296827 A1 20040709; AU 2003296827 A8 20040709; EP 1610927 A2 20060104; US 2005063797 A1 20050324; US 7244088 B2 20070717
DOCDB simple family (application)
FR 0303688 W 20031212; AU 2003296827 A 20031212; EP 03813172 A 20031212; US 73472303 A 20031212