EP 1611585 A2 20060104 - POWER CABLE COMPOSITIONS FOR STRIPPABLE ADHESION
Title (en)
POWER CABLE COMPOSITIONS FOR STRIPPABLE ADHESION
Title (de)
STROMKABELZUSAMMENSETZUNGEN FÜR ABISOLIERBARE HAFTUNG
Title (fr)
COMPOSITIONS POUR CABLE D'ALIMENTATION POUR ADHESIF PELABLE
Publication
Application
Priority
- US 2004009075 W 20040325
- US 45794303 P 20030327
Abstract (en)
[origin: WO2004088674A1] The present invention is a semiconductive power cable composition made from or containing (a) a mixture of a hightemperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.
IPC 1-7
H01B 1/20; H01B 1/22; H01B 1/24; C08L 23/08; C08L 23/10; C08L 67/00; C08L 69/00; C08K 3/04; C08K 3/00; C08K 3/10; C08K 7/06
IPC 8 full level
C08L 23/08 (2006.01); C08L 67/00 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C08L 7/00 (2006.01); C08L 9/00 (2006.01); C08L 15/00 (2006.01); C08L 23/04 (2006.01); C08L 23/10 (2006.01); C08L 67/02 (2006.01); C08L 77/00 (2006.01); C08L 77/10 (2006.01); C08L 81/06 (2006.01)
CPC (source: EP US)
B82Y 30/00 (2013.01 - EP US); C08L 23/04 (2013.01 - EP US); C08L 23/0853 (2013.01 - EP US); C08L 23/10 (2013.01 - EP US); C08L 67/00 (2013.01 - EP US); H01B 3/441 (2013.01 - EP US); C08K 3/04 (2013.01 - EP US); C08K 3/041 (2017.04 - EP US); C08K 3/08 (2013.01 - EP US); C08K 2201/001 (2013.01 - EP US); C08L 7/00 (2013.01 - EP US); C08L 9/00 (2013.01 - EP US); C08L 15/00 (2013.01 - EP US); C08L 67/02 (2013.01 - EP US); C08L 77/00 (2013.01 - EP US); C08L 77/10 (2013.01 - EP US); C08L 81/06 (2013.01 - EP US); C08L 2205/02 (2013.01 - EP US); Y10T 428/2913 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004088674 A1 20041014; WO 2004088674 B1 20041216; CA 2520362 A1 20041014; CN 1762029 A 20060419; EP 1611585 A2 20060104; JP 2006521679 A 20060921; MX PA05010313 A 20051117; TW 200502995 A 20050116; US 2006182961 A1 20060817
DOCDB simple family (application)
US 2004009075 W 20040325; CA 2520362 A 20040325; CN 200480007560 A 20040325; EP 04758293 A 20040325; JP 2006509265 A 20040325; MX PA05010313 A 20040325; TW 93108401 A 20040326; US 54982805 A 20050920