EP 1612021 B1 20090902 - Release film for encapsulation of semiconductor chip
Title (en)
Release film for encapsulation of semiconductor chip
Title (de)
Trennfolie für die Einkapselung von Halbleiterchips
Title (fr)
Film de relâchement pour l'encapsulation des puces semi-conductrices
Publication
Application
Priority
JP 2004191258 A 20040629
Abstract (en)
[origin: EP1612021A1] A release film for encapsulation of a semiconductor chip, which is a laminated film comprising a substrate film consisting of an oriented polyester resin film and a film made of a fluororesin laminated on at least one side of the substrate film.
IPC 8 full level
B29C 33/68 (2006.01); B32B 27/08 (2006.01); H01L 21/56 (2006.01); B29K 27/12 (2006.01); B29K 67/00 (2006.01)
CPC (source: EP)
B29C 33/68 (2013.01); B32B 27/08 (2013.01); B29K 2027/12 (2013.01); B29K 2067/00 (2013.01)
Designated contracting state (EPC)
DE FR NL
DOCDB simple family (publication)
EP 1612021 A1 20060104; EP 1612021 B1 20090902; CN 100471672 C 20090325; CN 1715046 A 20060104; DE 602005016337 D1 20091015; SG 118414 A1 20060127; TW 200615107 A 20060516; TW I393621 B 20130421
DOCDB simple family (application)
EP 05012667 A 20050613; CN 200510082097 A 20050628; DE 602005016337 T 20050613; SG 200504111 A 20050627; TW 94121653 A 20050628