EP 1614158 A2 20060111 - MULTICHIP MODULE COMPRISING A PLURALITY OF SEMICONDUCTOR CHIPS AND PRINTED CIRCUIT BOARD COMPRISING A PLURALITY OF COMPONENTS
Title (en)
MULTICHIP MODULE COMPRISING A PLURALITY OF SEMICONDUCTOR CHIPS AND PRINTED CIRCUIT BOARD COMPRISING A PLURALITY OF COMPONENTS
Title (de)
MULTICHIPMODUL MIT MEHREREN HALBLEITERCHIPS SOWIE LEITERPLATTE MIT MEHREREN KOMPONENTEN
Title (fr)
MODULE MULTIPUCES COMPORTANT PLUSIEURS PUCES DE SEMICONDUCTEUR ET CARTE DE CIRCUITS COMPORTANT PLUSIEURS COMPOSANTS
Publication
Application
Priority
- DE 2004000750 W 20040408
- DE 10317018 A 20030411
Abstract (en)
[origin: WO2004093190A2] The invention relates to a multichip module comprising at least one first semiconductor chip (2) and at least one second semiconductor chip (3). Said semiconductor chips (2, 3) are arranged on or in a carrier medium (51) in a coplanar manner and respectively comprise corresponding components and contact surfaces (A1, A5) on the active upper sides thereof. At least one other semiconductor chip (3) comprises an arrangement of contact surfaces (A1, A5) which is mirror-inverted in relation to the first semiconductor chip (2). At least one first semiconductor chip (2) and at least one second semiconductor chip (3) are arranged adjacently and/or successively in such a way that the edges thereof which respectively have a corresponding arrangement of contact surfaces (A1, A5) are located opposite each other. Wirings (55, 56) extend between respectively opposite contact surfaces (A1, A5) and between contact surfaces (A1) located on the outer edges of the semiconductor chips (2, 3) and outer contacts (54).
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
H01L 23/5389 (2013.01 - EP US); H01L 24/19 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/96 (2013.01 - EP US); H01L 25/0655 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/12105 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/16227 (2013.01 - EP US); H01L 2224/20 (2013.01 - EP US); H01L 2224/211 (2013.01 - EP US); H01L 2224/24137 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48464 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/85 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0101 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/1532 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 2004093190A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004093190 A2 20041028; WO 2004093190 A3 20050324; DE 10317018 A1 20041118; EP 1614158 A2 20060111; US 2006060954 A1 20060323; US 7317251 B2 20080108
DOCDB simple family (application)
DE 2004000750 W 20040408; DE 10317018 A 20030411; EP 04726437 A 20040408; US 24656305 A 20051011