EP 1615487 A3 20080220 - Mounting substrate and driving device using same
Title (en)
Mounting substrate and driving device using same
Title (de)
Montagesubstrat und Antriebsvorrichtung mit einem solchen
Title (fr)
Substrat de montage et dispositif d'entraînement utilisant ledit substrat
Publication
Application
Priority
JP 2004199264 A 20040706
Abstract (en)
[origin: EP1615487A2] A driving device for a motor has a mounting substrate (30) mounted to a base substrate (21). Highly heat-generating components such as a switching element for PWM control are mounted to the mounting substrate and only less heat-generating circuit components are mounted to the base substrate. The mounting substrate has a base plate part (32) made of a metallic plate material surround by a molded insulating material but includes a heat dissipating part (38a) where the insulating material is removed and the internal metallic plate material is exposed.
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP US)
H05K 1/0203 (2013.01 - EP US); H05K 1/141 (2013.01 - EP US); H05K 7/20909 (2013.01 - EP US); H05K 3/202 (2013.01 - EP US); H05K 3/4092 (2013.01 - EP US); H05K 2201/09118 (2013.01 - EP US)
Citation (search report)
- [A] EP 1178584 A2 20020206 - AUTONETWORKS TECHNOLOGIES LTD [JP], et al
- [DA] JP H10201050 A 19980731 - HARNESS SOGO GIJUTSU KENKYUSHO, et al
- [A] US 2003231088 A1 20031218 - KIKUCHI HIROSHI [JP], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
EP 1615487 A2 20060111; EP 1615487 A3 20080220; EP 1615487 B1 20081231; AT E419739 T1 20090115; DE 602005012027 D1 20090212; JP 2006024620 A 20060126; JP 4284531 B2 20090624; US 2006007643 A1 20060112; US 7269019 B2 20070911
DOCDB simple family (application)
EP 05014469 A 20050704; AT 05014469 T 20050704; DE 602005012027 T 20050704; JP 2004199264 A 20040706; US 16574205 A 20050625