Global Patent Index - EP 1616664 A2

EP 1616664 A2 20060118 - Polishing process for polishing of rotationally symmetric workpieces

Title (en)

Polishing process for polishing of rotationally symmetric workpieces

Title (de)

Polierverfahren zum Polieren rotationssymmetrischer Werkstücke

Title (fr)

Procédé de polissage pour des pièces ayant une symétrie de rotation

Publication

EP 1616664 A2 20060118 (DE)

Application

EP 05019364 A 20030219

Priority

  • EP 03003748 A 20030219
  • DE 10221842 A 20020516

Abstract (en)

The workpiece (F) is dipped into a container (12) filled with abrasive and moved relative to the abrasive container. The workpiece is then moved up and down vertically, turned on its central axis (B) and moved inside the container on its central axis.

IPC 8 full level

B24B 31/00 (2006.01)

CPC (source: EP US)

B24B 31/003 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

DOCDB simple family (publication)

EP 1362669 A2 20031119; EP 1362669 A3 20031210; EP 1362669 B1 20060906; AT E338610 T1 20060915; AT E368547 T1 20070815; DE 10221842 A1 20031127; DE 50304919 D1 20061019; DE 50307841 D1 20070913; EP 1616664 A2 20060118; EP 1616664 A3 20060125; EP 1616664 B1 20070801; US 2003216110 A1 20031120; US 2005136802 A1 20050623; US 6918818 B2 20050719; US 7048613 B2 20060523

DOCDB simple family (application)

EP 03003748 A 20030219; AT 03003748 T 20030219; AT 05019364 T 20030219; DE 10221842 A 20020516; DE 50304919 T 20030219; DE 50307841 T 20030219; EP 05019364 A 20030219; US 39491003 A 20030320; US 5451405 A 20050208