EP 1618992 A1 20060125 - Device and process for grinding and/or polishing surfaces
Title (en)
Device and process for grinding and/or polishing surfaces
Title (de)
Vorrichtung und Verfahren zum Schleifen und/oder Polieren von Oberflächen
Title (fr)
Dispositif et procédé de meulage et/ou polissage de surfaces
Publication
Application
Priority
EP 04017330 A 20040722
Abstract (en)
The grinding and/or polishing device (1) grinds material from a surface (S) of a workpiece (2), grinding it with abrasive particles (5) supplied in a liquid (3). The grinding device includes a device for setting the gas content in the fluid, in particular, to remove a gas (4) usually air, from the fluid; this may include a pump (7).
IPC 8 full level
B24C 1/08 (2006.01)
CPC (source: EP)
B24C 1/04 (2013.01); B24C 1/08 (2013.01); B24C 7/0007 (2013.01); B24C 7/0084 (2013.01); B24C 11/005 (2013.01)
Citation (search report)
- [X] US 2002132568 A1 20020919 - MIZUNO TOSHIAKI [JP]
- [XY] US 5384989 A 19950131 - SHIBANO YOSHIHIDE [JP]
- [DY] DE 10113599 A1 20021002 - FISBA OPTIK AG ST GALLEN [CH]
- [DY] US 5700181 A 19971223 - HASHISH MOHAMED AHMED [US], et al
- [A] US 5372634 A 19941213 - MONAHAN PATRICK J [US]
- [A] GB 225639 A 19241211 - JAMES BORROWMAN MACLEAN, et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1618992 A1 20060125; EP 1618992 B1 20081015; AT E411138 T1 20081015; DE 502004008269 D1 20081127
DOCDB simple family (application)
EP 04017330 A 20040722; AT 04017330 T 20040722; DE 502004008269 T 20040722