EP 1620889 A1 20060201 - METHOD AND APPARATUS FOR THE MULTIPLEXED ACQUISITION OF A BARE DIE FROM A WAFER
Title (en)
METHOD AND APPARATUS FOR THE MULTIPLEXED ACQUISITION OF A BARE DIE FROM A WAFER
Title (de)
VERFAHREN UND VORRICHTUNG ZUM GEMULTIPLEXTEN BESCHAFFEN EINES ROHCHIPS AUS EINEM WAFER
Title (fr)
PROCEDE ET APPAREIL PERMETTANT L'ACQUISITION MULTIPLEXEE D'UNE PUCE NUE A PARTIR D'UNE PLAQUETTE
Publication
Application
Priority
- US 2004014373 W 20040506
- US 43062103 A 20030506
Abstract (en)
[origin: US2003211652A1] A method for the co-processing of bare die removal from a semiconductor wafer for the improved throughput of the extraction of die from a wafer for subsequent placement onto a substrate. The apparatus includes a pick head containing a nozzle having a suction port within that secures the bare die as it is removed from the wafer. The intermediate holding station has a plurality of nozzles, each having a vacuum port to secure and buffer a multitude of flipped die that are transferred from the pick nozzle. Vacuum flow valves enable the release and transfer of the bare die. Having a multiple of nozzles provides a buffer for the die as they are subsequently transitioned from the pick nozzle, queued within the intermediate transfer station and loaded in tandem onto a die shuttle.
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP US)
H01L 21/67144 (2013.01 - EP US); H01L 21/6838 (2013.01 - EP US); Y10S 156/942 (2013.01 - EP US); Y10T 29/49819 (2015.01 - EP US); Y10T 29/49824 (2015.01 - EP US); Y10T 156/11 (2015.01 - EP US); Y10T 156/1132 (2015.01 - EP US); Y10T 156/1906 (2015.01 - EP US); Y10T 156/1978 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2003211652 A1 20031113; US 6773543 B2 20040810; EP 1620889 A1 20060201; EP 1620889 A4 20100825; EP 1620889 B1 20131016; WO 2004100251 A1 20041118
DOCDB simple family (application)
US 43062103 A 20030506; EP 04760735 A 20040506; US 2004014373 W 20040506