EP 1622715 A1 20060208 - COMPONENT USED IN MICROPROCESS CONTROL
Title (en)
COMPONENT USED IN MICROPROCESS CONTROL
Title (de)
MIKROVERFAHRENSCHNISCHER BAUSTEIN
Title (fr)
MODULE MICROMINIATURISE
Publication
Application
Priority
- EP 2004004098 W 20040417
- DE 10321115 A 20030509
- DE 10344227 A 20030924
Abstract (en)
[origin: WO2004098768A1] The invention relates to a component used in microprocess control that comprises at least one process control microfluidic element (4) and microfluidic channel connections (9) and that is provided with a thermally insulating housing (1) surrounding the microfluidic element (4). The microfluidic channel connections (9) are guided through the housing (1). Linking elements for linking individual housings (1) are disposed on the housing (1) in such a manner that the respectively assigned microfluidic channel connections (9) can be sealingly interlinked. The microfluidic element (4) is interposed between a connection block (3) and a heat transfer block (2), and the temperature of the heat transfer block (2) and the connection block (3) and thus of the microfluidic element (4) can be controlled. A linking element for interlinking individual housings (1) has a conical screw (21) with a threaded section (22) and a conically tapered section (23). A locking pin (18) with a bore (19) adapted to the conical screw (21) and projecting from a first of the housings (1) to be interlinked is introduced into a recess (20) of a second housing (1) which recess is adapted to the locking pin (18). The locking pin is tightly pressed into said recess by means of the conical screw (21) whose conically tapered section (23) is engaged with the bore (19) of the locking pin (18).
IPC 1-7
IPC 8 full level
B01J 19/00 (2006.01); B01L 3/00 (2006.01); B01F 13/00 (2006.01)
CPC (source: EP US)
B01F 35/561 (2022.01 - EP US); B01J 19/0093 (2013.01 - EP US); B01L 3/502715 (2013.01 - EP US); B01F 33/30 (2022.01 - EP US); B01J 2219/0081 (2013.01 - EP US); B01J 2219/00824 (2013.01 - EP US); B01L 2200/025 (2013.01 - EP US); B01L 2200/027 (2013.01 - EP US); B01L 2300/0627 (2013.01 - EP US); B01L 2300/1805 (2013.01 - EP US); B01L 2300/1838 (2013.01 - EP US); B01L 2300/1883 (2013.01 - EP US)
Citation (search report)
See references of WO 2004098768A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004098768 A1 20041118; EP 1622715 A1 20060208; JP 2006526492 A 20061124; US 2007077179 A1 20070405
DOCDB simple family (application)
EP 2004004098 W 20040417; EP 04728110 A 20040417; JP 2006505176 A 20040417; US 55535704 A 20040417