EP 1623278 A1 20060208 - RESIST COMPOSITION AND ORGANIC SOLVENT FOR REMOVING RESIST
Title (en)
RESIST COMPOSITION AND ORGANIC SOLVENT FOR REMOVING RESIST
Title (de)
RESISTZUSAMMENSETZUNG UND ORGANISCHES LÖSUNGSMITTEL ZUR ENTFERNUNG VON RESIST
Title (fr)
COMPOSITION DE RESINE ET SOLVANT ORGANIQUE UTILISE POUR ELIMINER CETTE RESERVE
Publication
Application
Priority
- KR 2004000935 W 20040423
- KR 20030026029 A 20030424
Abstract (en)
[origin: WO2004095142A1] The present invention provides a resist composition comprising benzyl alcohol or its derivatives as an organic solvent. The present invention also provides an organic solvent for removing a resist, wherein the organic solvent comprises benzyl alcohol or its derivatives. The resist composition of the present invention is used in a lithography process for forming a micro -pattern using a difference in the solubility between the irradiated part and the non-irradiated part by irradiation with UV rays to greatly improve the uniformity of the film thickness upon coating of the thin film. In addition, the organic solvent according to the present invention can be used to wash the device, which comes into contact with the photosensitive material in the course of the microcircuit forming process, by removing the photosensitive material from the device. It also can remove the photosensitive material remaining on the undesired parts of the substrate on which the photosensitive material is coated.
IPC 1-7
IPC 8 full level
G03F 7/004 (2006.01); G03F 7/022 (2006.01)
CPC (source: EP KR US)
G03F 7/0048 (2013.01 - EP US); G03F 7/022 (2013.01 - KR); G03F 7/0226 (2013.01 - EP US)
Citation (search report)
See references of WO 2004095142A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004095142 A1 20041104; CN 100541338 C 20090916; CN 1777842 A 20060524; EP 1623278 A1 20060208; JP 2007531897 A 20071108; JP 4554599 B2 20100929; KR 20040092550 A 20041104; TW 200508793 A 20050301; TW I325097 B 20100521; US 2006263714 A1 20061123
DOCDB simple family (application)
KR 2004000935 W 20040423; CN 200480010756 A 20040423; EP 04729317 A 20040423; JP 2006507817 A 20040423; KR 20030026029 A 20030424; TW 93110915 A 20040420; US 55121505 A 20050928