EP 1625627 A2 20060215 - PRODUCTION OF AN OPTOELECTRONIC COMPONENT THAT IS ENCAPSULATED IN PLASTIC, AND CORRESPONDING METHODS
Title (en)
PRODUCTION OF AN OPTOELECTRONIC COMPONENT THAT IS ENCAPSULATED IN PLASTIC, AND CORRESPONDING METHODS
Title (de)
HERSTELLEN EINES IN KUNSTSTOFF EINGEKAPSELTEN OPTOELEKTRONISCHEN BAUELEMENTES UND ZUGEHÖRIGE VERFAHREN
Title (fr)
PRODUCTION D'UN COMPOSANT OPTOELECTRONIQUE ENCAPSULE, DANS UNE MATIERE PLASTIQUE, ET PROCEDES CORRESPONDANTS
Publication
Application
Priority
- DE 2004001045 W 20040519
- DE 10322751 A 20030519
Abstract (en)
[origin: WO2004105117A2] The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip (11) and an optical window (10). A hermetic inclusion of at least the optically active areas of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses (7) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer (1) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing (8) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined.
IPC 1-7
IPC 8 full level
H10N 80/00 (2023.01); H01L 21/50 (2006.01); H01L 21/58 (2006.01); H01L 27/14 (2006.01); H01L 31/0203 (2006.01); H01L 31/0232 (2006.01); H01L 33/00 (2006.01)
CPC (source: EP US)
H01L 31/0203 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004105117 A2 20041202; WO 2004105117 A3 20050203; WO 2004105117 A8 20051222; EP 1625627 A2 20060215; US 2006124915 A1 20060615
DOCDB simple family (application)
DE 2004001045 W 20040519; EP 04738518 A 20040519; US 55698004 A 20040519