Global Patent Index - EP 1625631 A1

EP 1625631 A1 20060215 - PULVERIZED ORGANIC SEMICONDUCTORS AND METHOD FOR VAPOR PHASE DEPOSITION ONTO A SUPPORT

Title (en)

PULVERIZED ORGANIC SEMICONDUCTORS AND METHOD FOR VAPOR PHASE DEPOSITION ONTO A SUPPORT

Title (de)

PULVERISIERTE ORGANISCHE HALBLEITER UND VERFAHREN ZUM AUFDAMPFEN AUF EINEN TR GER

Title (fr)

SEMI-CONDUCTEUR ORGANIQUE PULVERISE ET PROCEDE DE DEPOT CHIMIQUE EN PHASE VAPEUR SUR UN SUPPORT

Publication

EP 1625631 A1 20060215 (DE)

Application

EP 04727889 A 20040416

Priority

  • EP 2004004039 W 20040416
  • DE 10319742 A 20030430

Abstract (en)

[origin: WO2004097955A1] The invention relates to a method for vapor phase deposition of one or several compounds onto a support by i) introducing the compound into a carrier gas stream in a solid or gaseous state, ii) providing said compound in a gaseous state in the carrier gas stream, iii) condensing the gaseous compound, iv) returning the compound condensed in step (iii) into the gaseous state, and then v) condensing the gaseous compound on the support, the carrier gas stream containing the gaseous compound(s) being cooled to a temperature that lies below the sublimation temperature of said compound(s) by adding a gas stream.

IPC 1-7

H01L 51/40; C23C 14/12

IPC 8 full level

C23C 14/12 (2006.01); H01L 51/40 (2006.01); H01L 51/00 (2006.01); H01L 51/30 (2006.01)

CPC (source: EP KR US)

C23C 14/12 (2013.01 - EP KR US); C23C 14/228 (2013.01 - EP US); H05B 33/10 (2013.01 - KR); H10K 30/00 (2023.02 - KR); H10K 71/164 (2023.02 - EP US); H10K 85/311 (2023.02 - EP US); Y02E 10/549 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US); Y10T 428/265 (2015.01 - EP US)

Citation (search report)

See references of WO 2004097955A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004097955 A1 20041111; CN 1802759 A 20060712; DE 10319742 A1 20041118; EP 1625631 A1 20060215; JP 2006525422 A 20061109; KR 20060007413 A 20060124; US 2007042178 A1 20070222

DOCDB simple family (application)

EP 2004004039 W 20040416; CN 200480015781 A 20040416; DE 10319742 A 20030430; EP 04727889 A 20040416; JP 2006505162 A 20040416; KR 20057020688 A 20051031; US 55484104 A 20040416