EP 1625680 A2 20060215 - METHOD FOR OPTIMIZING HIGH FREQUENCY PERFORMANCE OF VIA STRUCTURES
Title (en)
METHOD FOR OPTIMIZING HIGH FREQUENCY PERFORMANCE OF VIA STRUCTURES
Title (de)
VERFAHREN ZUR OPTIMIERUNG DER HOCHFREQUENZLEISTUNG VON DURCHGANGSSTRUKTUREN
Title (fr)
PROCEDE POUR OPTIMISER LA PERFORMANCE HAUTE FREQUENCE DE STRUCTURES DE TROUS D'INTERCONNEXION
Publication
Application
Priority
US 0306836 W 20030306
Abstract (en)
[origin: WO2004082180A2] A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. The method may involve the use of the S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis may be performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the sub-circuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.
IPC 1-7
IPC 8 full level
G06F 17/50 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC (source: EP KR)
G06F 30/367 (2020.01 - EP); G06F 30/39 (2020.01 - EP); H01P 1/203 (2013.01 - KR); H05K 3/0005 (2013.01 - EP); H05K 1/023 (2013.01 - EP); H05K 1/0237 (2013.01 - EP); H05K 1/115 (2013.01 - EP); H05K 2203/163 (2013.01 - EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004082180 A2 20040923; WO 2004082180 A3 20061228; AU 2003225687 A1 20040930; AU 2003225687 A8 20040930; CN 1989503 A 20070627; CN 1989503 B 20100804; EP 1625680 A2 20060215; EP 1625680 A4 20090408; JP 2006526883 A 20061124; KR 101041555 B1 20110615; KR 20060006776 A 20060119
DOCDB simple family (application)
US 0306836 W 20030306; AU 2003225687 A 20030306; CN 03826090 A 20030306; EP 03816274 A 20030306; JP 2004569398 A 20030306; KR 20057016653 A 20030306